AltaCVD
Altatech
ALD, CVD in one tool
The AltaCVD targets plasma-enhanced MOCVD and ALD processes of a wide range of materials used in logic and memory devices, as well as in microsystems and 3D integration. It encompasses both chemical vapor deposition (CVD) and atomic layer deposition (ALD) through a unique vaporizing technology, chamber design, and gas/liquid panel to deposit new, viscous, and nonvolatile precursors. A proprietary reactor design and precursor introduction path with a pulsed liquid injection and vaporization enables nanoscale control of thickness, uniformity, composition, and stoichiometry. Altatech, Grenoble-Montbonnot, France; ph +33/456.526.800, www.altatech-sc.com.
Candela 7100
KLA-Tencor Corp.
Defect inspection for HDDs
The Candela 7100 series for advanced defect inspection and classification of hard disk drive substrates and media (both metal and glass) incorporates a new dual-wavelength laser configuration, which is optimized for higher sensitivity, flexibility in application recipe settings for layer-based power modes, and improved laser output and stability. Multiple independent scatter detectors enable detection and classification of sub-micron defects (pits, bumps, particles, buried defects). Improved phase, specular, and magnetic channels offer improved sensitivity and stability for capturing stains and imaging advanced perpendicular magnetic recording (PMR) surfaces. KLA-Tencor Corp., Milpitas, CA; ph 408/875.3000, www.kla-tencor.com.
MA/BA8 mask/bond
Suss MicroTec
6-in-1 mask alignment/bonding
The third generation of the MA/BA8 mask/bond aligner offers submicron alignment (down to 0.25µm) and exposure optics dedicated for thick resist exposure, upgradeable to emerging technologies such as UV (NIL, SCIL) and microlens imprinting (SMILE), UV-bonding, and enhanced bond alignment. It also offers shadow mask alignment for evaporation applications, and a near-field holography module for producing diffractive gratings down to 100nm. Processes developed on the MA/BA8 Gen3 can be quickly transferred onto an automated Suss mask aligner for high-volume production, which is based on the same technology. Suss MicroTec, Garching, Germany; ph +49/893.2007.395, www.suss.com.
ACuPLANE
Rohm and Haas Electronic Materials
Tunable Cu CMP system
The ACuPLANE copper barrier CMP system for advanced Cu/low-k interconnect applications combines Rohm and Haas’s EcoVision 4000 CMP Pad and ACuPLANE 5000 Series slurries. This tunable CMP system offers <5% within-wafer and within-die nonuniformity, and “extremely low” defectivity when used with the company’s Politex and VisionPad products. The company says customer tests indicate 2-3× extension of average pad life. Rohm and Haas Electronic Materials, CMP Technologies, Newark, DE; ph 302/366.0500, www.rohmhaas.com.
ChemLogic
DOD Technologies Inc.
Gas monitoring system
The ChemLogic 96 point continuous monitor provides quick detection of low-level toxic and corrosive gases. Features include new intelligent optics and an optimized flow system. Gases detected include a variety of hydrides (AsH3, PH3, B2H6, GeH4, SiH4, H2Se, and H2S) and mineral acids (HDL, HF, BF3, and HBR), as well as ammonia, chlorine, and phosgene. Use of 1/4” tubing allows for easy upgrades of other obsolete sample draw systems. DOD Technologies Inc., Crystal Lake, IL; ph 815/788.5200, www.dodtec.com.
S2012PV
Viscom AG
AOI for solar cells
The S2012PV automated optical inspection system targets solar cell production, including wafer material control, cell characterization, and cell control (i.e., geometry, print image, cracks, color, micro cracks). Interlinked matrix cameras enable various resolutions (48, 37. or 34µm/pixel). A specially developed calibration concept ensures genuine measurement accuracy and sustained reproducibility for all inspection tasks. The image field is large enough for standard 156 × 156mm (6.1” x 6.1”) wafers. Viscom AG, Hanover, Germany; ph +49/511.949.960, www.viscom.com.
SD1024FH
Verity Instruments Inc.
Spectrograph for etch control
The SD1024FH spectrograph is designed for demanding semiconductor process control applications such as very low exposed area contact etch, ion beam etch, and photomask etch. Features include a 200-800nm spectral range optical system with a 1024-element thermoelectrically cooled CCD sensor, optimized UV response, resolution <2nm, signal/noise ratio of >1000 at full scale, and 7msec readout time. Verity Instruments Inc., Carrollton, TX; ph 972/446.9990, www.verityinst.com.
TREK
Trek Inc.
ESD monitoring
The TREK model 875 electrostatic voltage sensor is designed for in-line monitoring of electrostatic charge build-up on production lines and other manufacturing process. An automatic calibration technique maintains high accuracy and speed over wide variations of spacing between the non-contacting measurement probe and the surface under test. Features include a voltage measurement range of ± 500V DC or peak AC, accuracy of ±0.5%, speed of 25msec, and low noise of 2.5% of full scale. Buffered output voltage and current monitors (4-20mA) are provided for remote monitoring and alarm purposes. Trek Inc., Medina, NY; ph 585/798.3140, www.trekinc.com.
compact ceramic piezo motors & actuators
Physik Instrumente
Precision Actuator Catalog
PI’s new line of compact ceramic piezo motors & actuators replaces classical actuators & motion control components. Advantages: no lubricants, high-speed, millisecond responsiveness, vacuum compatible, non-magnetic. Zero-wear flexure designs available. Applications: Lithography, optics & imaging, nanotechnology, high magnetic fields, vacuum, fast pumps, scanning microscopy, OCT, MRI.
PI (Physik Instrumente) L.P.
16 Albert St., Auburn, MA, 01501
T: 508.832.3456
www.pi-usa.us
info@pi-usa.us
|
|
eNewsletter
Magazines
About Us
|
Advertise
|
Contact Us
|
Site Map
