Model-based mask verification on 45nm logic gate masks
In the continuous battle to improve critical dimension (CD) uniformity, especially for 45nm advanced logic products, one important recent advance is the ability to accurately verify the mask CD unifor ...
On-the-fly circular substrate centering for robotized vacuum systems
A new method for on-the-fly detection and correction of substrate-centering inaccuracies of a circular substrate is presented.
Tool hookup: a paradigm shift to modularization
As semiconductor manufacturers continue to address cost, speed, and safety as key components of capital equipment tool installations in the last several years, few solutions exist to address the need ...
Optimizing feedback time using high-throughput darkfield imaging
A fab’s inspection strategy is based on many variables, including the process technology, defect mechanisms, inspection equipment, fab logistics, and financial parameters [1].
The Power and Allure of “Other”
It is relatively easy to define the mainstream semiconductor market as simply silicon-based CMOS logic and memory.
Seeking process windows for 32nm USJs using MSA
Susan Felch, principal member of the technical staff, frontend development at Spansion, summarized research she conducted while at Applied Materials�and done with IMEC�at the West Coast Junction T ...
IMEC, ASML: Another step closer to production-worthy EUV
Kicking off this year’s SEMICON West, IMEC said it has been able to achieve electrically functional 32nm SRAM cells (FinFETs).
Remote connectivity reduces costs for burgeoning solar industry
The solar industry is blazing a new trail around the globe in a very similar way to the global expansion that the semiconductor industry experienced in the 1990s.