Parylenes for flexible electronics and display applications
A chemical vapor deposition (CVD) polymer technology has been developed to use low cost monomers and provide highly crystalline and thermally stable polymer films for the sub-65μm ICs and OLED disp ...
Optical in situ monitoring in LED device production
The most significant issue in LED MOCVD growth today is precise control of the wafer temperature throughout the whole growth process.
Raising the bar on wafer edge yield—an etch perspective
A variety of plasma techniques have been introduced to manage the unique dielectric and conductor etch challenges encountered at the wafer’s edge, as well as address bevel-clean challenges that ...
Kudos to Tech Award Laureates
This month, a group of individuals will receive some well deserved recognition for their work in developing technical solutions that benefit humanity and address the most critical issues facing our pl ...
Betting on a 2009 recovery? Not so fast
Gartner now expects capex to slide even further this year (-25% to $47.1B) and will drop another 13% in 2009 to $41.1B, thanks to a full-on collapse in memory investments and economic pressures on con ...
Diskcon: HDD litho crossover happening now
A full-day symposium at this year’s Diskcon USA (Sept. 14-18) explored the lithography implications of sub-ITRS roadmap feature sizes on disk drives, with the challenge that HDD lithography must ...
Slurry reduction is “groovy” at Rohm and Haas
Rohm and Haas Electronic Materials recently announced CMP pad groove designs that enable defect and slurry reduction.
To 32nm and beyond: a design-manufacturing symbiosis
At the 32nm node, technology enablers such as double-patterning, strain enhancement, advanced OPC, etc., require design for manufacturing (DFM) to support a design through manufacturing (D2M) methodol ...