Automated mass spectrometry to detect impurities in harsh acid chemistries
An automated, in-line mass-spectrometry (ILMS) system using basic time-of-flight principles has been developed that can detect part-per-trillion contamination levels of metals in harsh acid chemistrie ...
Late-porogen removal integration for ultra-low-keff IMDs
The value keff has become a valuable metric for evaluating the quality of the final integrated intermetal dielectric (IMD) film stack.
Optimizing process window robustness with reconfigurable OPC
In this work, a reconfigurable optical proximity correction (OPC) approach is taken to enhance process window robustness for sub-100nm designs.
Analyzing Si-based structures in 3D with a laser-pulsed local electrode atom probe
The addition of high-speed laser pulsing and local electrode geometry has transformed the 3D atom probe into a metrology tool that is capable of analyzing Si-based nanostructures on an atom-by-atom ba ...
A high-temperature batch-spray process for implanted resist stripping
Photoresist stripping in IC manufacturing has become more challenging as the number of photoresist levels has increased, while at the same time allowable material loss and surface damage has decreased ...
Mapping progress in 3D IC integration
As the limits to continued CMOS scaling loom larger, system designers are increasingly turning to multichip packages as a means to enhance performance without fitting ever more devices on a single chi ...
Chasing rainbows in the Nanoworld?
Nanotechnology is seen by many as “the next big thing.” It promises many new types of devices and effects that could be used in sensors, displays, light sources, and a host of other applic ...
World News
After hitting a low point at the end of 2005, capital equipment investments by semiconductor firms are expected to pick up again in 2006 with 14% growth, nearly twice that of earlier predictions, acco ...
IBM constructs IC along single-walled CNT
IBM researchers have fabricated a CMOS-type ring oscillator circuit entirely on one 18µm-long, single-walled carbon nanotube (SWCNT) using standard semiconductor processes [1], and taking advantage o ...
Semiconductor applications using >short-pulsed UV lasers
Excimer and UV diode-pumped solid-state (DPSS) lasers can be used by the semiconductor industry, and others, in applications that cannot be performed by mechanical, chemical, or other laser fabricatio ...
Handset functionality drives mobile display processes
Manufacturers of mobile displays are responding to demands from the market for improved features and performance by turning to innovative product design, selection of more suitable materials, and upgr ...
A new ballgame for lithography beyond higher NA
While the leading lithography equipment suppliers race to achieve systems with higher numerical apertures, they are employing radically different means to achieve their ends.
Semicon West 2006
The 36th annual SEMICON West conference and exhibition will be held in San Francisco again this year with new special areas devoted to solving challenging problems.
SEMICON West 2006 Product News
The VB-300 e-beam lithography tool, successor to the VB6-UHR EWF, incorporates a 100kV high-brightness gun and 50MHz/20bit intelligent pattern generator, with field size capability of 1.
Are “finishing fabs” the answer to 450mm wafers?
The 2005 International Technology Roadmap for Semiconductors (ITRS, p. 75) has generated a lot of press by designating the 450mm wafer size for production in 2012.
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