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Solid State Technology

Volume: 49
Issue: 5
Date: May 01, 2006
The thin-film landscape for ALD processing
Different manufacturing requirements for major IC device types call for different thin-film material requirements.
The challenges of commercializing flexible displays
One of the most exciting areas in the flat panel display industry is the emergence of flexible displays.
Annealing techniques for optimizing 45nm-node USJs
Various p+ extension implantation dopant species and annealing techniques (spike, flash, laser, and SPE) were investigated to achieve high dopant activation and low damage ultra-shallow junctions (USJ ...
What do you do with a billion transistors on a chip?
Some time ago, a group of chip industry veterans pointed to a quandary facing the industry as we moved toward a billion transistors on a chip and beyond.
World News
Technology news
Surface-finishing techniques for stainless steel passivation
There is considerable value in identifying optimum surface-finishing techniques for 316L stainless steel used in ultrahigh purity gas applications in the semiconductor industry.
Immersion’s evolution launches the age of hyper-NA lithography
Immersion arrived on the lithography roadmap shortly after the first immersion images became available in the fall of 2003.
Product news
Future challenges in computational lithography
Today, the errors associated with modeling the lithography process constitute one of the largest error sources in IC manufacturing, according to the modeling and simulation section of the 2005 Inte ...

Past Issues

2006

Volume Issue Date
49 12 Dec 01, 2006
49 11 Nov 01, 2006
49 10 Oct 01, 2006
49 9 Sep 01, 2006
49 8 Aug 01, 2006
49 7 Jul 01, 2006
49 6 Jun 01, 2006
49 5 May 01, 2006
49 4 Apr 01, 2006
49 3 Mar 01, 2006
49 2 Feb 01, 2006
49 1 Jan 01, 2006

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