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Solid State Technology

Volume: 49
Issue: 4
Date: April 01, 2006
Optimizing SU-8 resist to fabricate micro-metallic structures
Conventional precision engineering technologies are reaching their limits concerning minimum feature size and precision demands, so alternative technologies, such as LIGA (from the German acronym: lit ...
MEMS applications using diamond thin films
Diamond thin film offers advantages over silicon and other thin-film materials used in micro- and nanofabrication.
Removing sub-50nm particles during blank substrate cleaning
The current International Technology Roadmap for Semiconductors (ITRS) requires that all defects ≥32nm on the EUV mask blank and ≥27nm on EUV substrates (i.e., mask blank before the mult ...
Creating metal and nonmetal nanosystems using conductive jettable inks
There is a great deal of interest in the development of ink-jettable systems for RFID tags and other types of interconnection.
Implant process modifications for suppressing WPE
The threshold voltages of CMOS transistors can vary significantly depending on their proximity to an implant well boundary.
Resistance at 450mm
According to the 2005 International Technology Roadmap for Semiconductors (ITRS), the industry should plan on shifting from 300mm to 450mm wafer production by the year 2012.
World News
Technology News
Product News
Encrypting process information for litho-aware OPC models
The practice of using design rules to communicate manufacturing capability to the design community failed with the advent of sub-wavelength imaging’s recommended and suggested design rules.
Improving 300mm wafer yield using x-ray diffraction inspection
Digital x-ray diffraction inspection of bare and patterned 300mm wafers is challenging conventional semiconductor wafer inspection systems.
Low-power electrical characterization of CNTs and nanoscale devices
Manufacturers of carbon nanotubes (CNTs) or other low-power nanoscale devices continue to face challenges as potential uses for these devices grow.
The essentials of single-wafer wet processing: selectivity and partnering
Chipmakers are migrating to single-wafer tools, driven by the need for highly reliable processes that can meet the stringent performance and throughput requirements of state-of-the-art fabs.

Past Issues

2006

Volume Issue Date
49 12 Dec 01, 2006
49 11 Nov 01, 2006
49 10 Oct 01, 2006
49 9 Sep 01, 2006
49 8 Aug 01, 2006
49 7 Jul 01, 2006
49 6 Jun 01, 2006
49 5 May 01, 2006
49 4 Apr 01, 2006
49 3 Mar 01, 2006
49 2 Feb 01, 2006
49 1 Jan 01, 2006

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