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Solid State Technology

Volume: 49
Issue: 3
Date: March 01, 2006
Challenges in the design and processing of future IC interconnects
The 2005 International Technology Roadmap for Semiconductors (ITRS) predicts that up to 11 layers of hierarchical wiring with a cumulative wire length >1.4km will be used in microprocessor c ...
Measuring deep-trench structures with model-based IR
Advanced DRAMs using deep-trench capacitors have small cell designs and excellent scaling potential.
Using mixed-fluid jet bombardment for advanced particle removal
R&D studies evaluate the particle-removal performance and safe limits of single-wafer cleaning techniques based on either immersion megasonics or mixed-fluid jet bombardment.
A crossflow filtration system for heavy-metal wastewater treatment
Semiconductor solder bump operations, in which chips are attached to their substrates using both lead and lead-free plating processes, produce wastewater containing heavy metals (primarily lead and ti ...
Chipmaking’s tough economic road ahead
Semiconductor manufacturing is entering a new phase. While great attention is being paid to coming technology challenges, the economics may prove even trickier.
World News
Technology News
New technologies drive demand for advanced FPD tools
Flat screen displays keep getting bigger, better, and cheaper. Currently, the market for large, flat TVs is dominated by plasma displays, but active matrix liquid crystal displays (AMLCD) are rapidly ...
Semicon Europa 2006 Preview
April 11-15, Munich, Germany
Wafer-level final test costs driven by MCPs and SIPs
Industry pundits have said that the current semiconductor cycle is being driven not by PC sales as in years past, but by a portability revolution featuring new mobile consumer electronics.
Product News
Fueling innovation with virtual re-aggregation
Disaggregation of the electronics design chain, along with industry-wide collaboration, is here to stay.
Work-force scaling challenges loom as China goes global
China’s electronics industry is moving onto the world stage with increasing momentum, due largely to strategic efforts aimed at increasing its manufacturing capability and narrowing its technolo ...
New fabs fuel solid growth of chipmaking in China
In the five years since the beginning of 2001, China has accounted for 21% of the industry’s new fab construction.

Past Issues

2006

Volume Issue Date
49 12 Dec 01, 2006
49 11 Nov 01, 2006
49 10 Oct 01, 2006
49 9 Sep 01, 2006
49 8 Aug 01, 2006
49 7 Jul 01, 2006
49 6 Jun 01, 2006
49 5 May 01, 2006
49 4 Apr 01, 2006
49 3 Mar 01, 2006
49 2 Feb 01, 2006
49 1 Jan 01, 2006

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