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Solid State Technology

Volume: 49
Issue: 2
Date: February 01, 2006
Advanced process control extends ECMP process consistency
ECMP provides greater control capabilities compared to CMP processes, and a multizone cathode allows for precise control over within-wafer uniformities.
The six billion dollar gap
Economists have been delivering dire warnings lately that the semiconductor industry will soon no longer be able to continue making IC devices smaller, faster, and cheaper at the same pace it has main ...
World News
Technology News
Fabricating buried tunnel junctions for InP-based VCSELs
Long-wavelength (λ≥1.3µm) vertical cavity surface emitting lasers (VCSEL) are highly attractive light sources for applications in optical communication and sensing.
Accuracy, speed, new physical phenomena: The future of litho simulation
Optical lithography modeling began in the early 1970s and represented the first serious attempt to describe lithography not as an art, but as a science.
Integrating MEMS devices using low-temperature wafer bonding
Long-term limitations of wafer bonding methods include surface roughness and substrate bow/warp considerations.
Product News
On entering a new era of product-driven technology
The international community expects a continuation of IC dimension scaling beyond the 22nm technology generation, with a technology node cycle of two to three years.
Frontend processes required for continued CMOS scaling
During the next several years, frontend processes will require the introduction of a variety of high-k materials and highly-engineered metal films for applications as diverse as MOSFET gate stacks, DR ...
Many options expected in the future of lithography
The 2005 ITRS details the qualitative challenges associated with - and the quantitative requirements for - lithography using the incumbent projection imaging at 193nm wavelength with immersion lenses.
Trends and challenges in MOSFET scaling
As in previous editions, the 2005 edition of the International Technology Roadmap for Semiconductors (ITRS) [1] projects rapid scaling of the physical dimensi ...

Past Issues

2006

Volume Issue Date
49 12 Dec 01, 2006
49 11 Nov 01, 2006
49 10 Oct 01, 2006
49 9 Sep 01, 2006
49 8 Aug 01, 2006
49 7 Jul 01, 2006
49 6 Jun 01, 2006
49 5 May 01, 2006
49 4 Apr 01, 2006
49 3 Mar 01, 2006
49 2 Feb 01, 2006
49 1 Jan 01, 2006

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