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Solid State Technology

Volume: 49
Issue: 12
Date: December 01, 2006
Improving yield in advanced technologies by modeling variability
As MOSFET device dimensions approach their fundamental limits [1-3], parametric variation in manufacturing has become a critical limiting factor for device performance and design yield of advanced CMO ...
Fujitsu reports progress toward CNT interconnects for 32nm
Development of carbon nanotube (CNT) interconnects for the 32nm node is starting to make major strides.
An alternative for shallow doping: gas cluster infusion
The inherent challenges for traditional ion implanters to deliver sufficiently high beam currents at sufficiently low energies required for shallow doping applications, such as USJ and polysilicon dop ...
Active spectral-control techniques for improving OPC
Improved optical proximity correction is needed to meet the tighter CD control budgets for advanced lithography processes. Laser bandwidth variation is one of the factors that contributes to the optic ...
Methods for analyzing and compensating for systematic mask CD errors
Mask CD uniformity requirements continue to tighten in response to the shrinking wafer CD uniformity budget and the upward trend of the mask error enhancement factor (MEEF).
Sustainable development: the next profit center?
Among the reasons typically cited for delaying the adoption of environmentally friendly designs and processes for semiconductor fabs are the added costs associated with energy-efficient and emission-r ...
BUSINESS TRENDS
Gartner Inc.’s October forecast projected $54.56 billion in semiconductor capital spending this year, representing 15.1% growth, slightly below its July forecast.
Mattson extends selective oxidation to advanced gate stacks
With thermal budgets becoming tighter at advanced nodes, some memory manufacturers are moving from batch furnaces to single-wafer tools.
Addressing 32nm half-pitch challenges with double-patterning lithography
Most semiconductor manufacturers expect 193nm immersion lithography to remain the dominant patterning technology through the 32nm technology node.
Maximizing capital productivity is key to the ‘fast follower’ strategy
The semiconductor industry requires a tremendous amount of investment. It takes some creativity and careful planning, but there are ways to generate better returns on that investment.
Top Products of 2006 Announced
Following are the Top Products of 2006 in semiconductor/thin-film processing, selected by Solid State Technology’s editorial advisory board from those featured each month in Product News.

Past Issues

2006

Volume Issue Date
49 12 Dec 01, 2006
49 11 Nov 01, 2006
49 10 Oct 01, 2006
49 9 Sep 01, 2006
49 8 Aug 01, 2006
49 7 Jul 01, 2006
49 6 Jun 01, 2006
49 5 May 01, 2006
49 4 Apr 01, 2006
49 3 Mar 01, 2006
49 2 Feb 01, 2006
49 1 Jan 01, 2006

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