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Solid State Technology

Volume: 49
Issue: 11
Date: November 01, 2006
Improving angle control in sub-65nm implantation
A new angle control technology has been developed to automatically measure beam angles before implant in both the horizontal and vertical planes and to correct for any deviation from the desired impla ...
Using ultrasonics to measure the strength of porous ULK dielectrics
Low-k dielectric materials permit faster IC operation and improve electrical performance, but these materials are generally weaker and prone to mechanical failure.
Pushing planar transistors to the limit using strained channel engineering
The quest to satisfy the low-power and low-leakage requirements of portable/mobile consumer electronics is driving efforts to improve transistor performance.
In situ monitoring of components to control dilute wet chemistries
Materials loss per cleaning cycle must be limited in advanced semiconductor process flows.
Science and technology’s excellent adventure?
As semiconductor processing nears physical limits, manipulating technology to push ever further gets steadily more challenging.
BUSINESS TRENDS
Chinese semiconductor fab capital expenditures have whipsawed over the past three years, but next year Chinese fab capex is expected to be flat, and will extend to a relatively moderate 24.
New materials take a “BiTe” out of high-end CPU hot spots
Hot-spots resulting from nonuniform power dissipation over a chip are the bane of manufacturers of high-performance ICs such as CPUs, graphics chips, and DSPs—and as CMOS devices continue to scal ...
Healthy photomask industry confronts data, RET challenges
The long-suffering mask making industry is presently in fine shape, according to experts at the 26th Annual BACUS Symposium on Photomask Technology in Monterey, CA, Sept.
Wafer-level packaging boosts yields of chip-on-board image sensors
Chip-on-board (COB) is the most dominant assembly process used to build over a million camera modules each day of the year.
Product news
The Candela Optical Surface Analyzer 6300 series provides full surface disk topography metrology in both radial and circumferential directions for data storage substrates and finished media.
Optical film-thickness metrology enters the mix-and-match era
Optical film measurement has evolved from manual offline analytical lab instruments to fully automated inline tools loaded with a wide array of measurement capabilities through adding and merging more ...
The secrets to achieving success with Japanese subsidiaries
As an early pioneer in the worldwide semiconductor market, Japan holds a place of strategic importance for any company that supplies materials, components, and equipment to Asian semiconductor and rel ...

Past Issues

2006

Volume Issue Date
49 12 Dec 01, 2006
49 11 Nov 01, 2006
49 10 Oct 01, 2006
49 9 Sep 01, 2006
49 8 Aug 01, 2006
49 7 Jul 01, 2006
49 6 Jun 01, 2006
49 5 May 01, 2006
49 4 Apr 01, 2006
49 3 Mar 01, 2006
49 2 Feb 01, 2006
49 1 Jan 01, 2006

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