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Solid State Technology

Volume: 48
Issue: 3
Date: March 01, 2005
Diverse CMP needs require a dielectric selectivity platform
It is likely the 45nm technology node will see the introduction of new materials and integration schemes.
Nanoimprint lithography enables patterned tracks for high-capacity hard disks
Advances in nanoimprint lithography (NIL) are being employed to introduce new manufacturing processes for next-generation thin-film disks, which use patterned substrates for land-and-groove structures ...
Physics and process drive etch performance at 45nm
Next-generation scaling is translating into more exacting specifications for many processes in semiconductor manufacture.
UV-assisted processing for advanced dielectric films
Ultraviolet-assisted thermal processing (UVTP) is emerging as a viable film-modification technology for advanced dielectric applications.
Choosing the right ionization gauge for high-vacuum processes
The selection of high-vacuum gauge technologies for measurements in pressure-dependent semiconductor processes can affect overall cost and manufacturing yields depending on the application and the env ...
Time for innovation
Conditions have never been better for a surge in innovative chip-based products, perhaps even whole new industry categories.
Metrology: A case of multiples
Solid State Technology asked industry experts to comment on the proliferation of metrology tools and what, if anything, can be done to mitigate the drawbacks.
Film monitoring of engineered substrates
The industry is seeing a gradual migration from standard silicon (Si) substrates to engineered substrates [1, 2].
Semicon Europa 2005 Preview
April 11-15, Munich, Germany
Products
Semicon Europa showcases semiconductor equipment, materials, and services in Europe.

Past Issues

2005

Volume Issue Date
48 12 Dec 01, 2005
48 11 Nov 01, 2005
48 10 Oct 01, 2005
48 9 Sep 01, 2005
48 8 Aug 01, 2005
48 7 Jul 01, 2005
48 6 Jun 01, 2005
48 5 May 01, 2005
48 4 Apr 01, 2005
48 3 Mar 01, 2005
48 2 Feb 01, 2005
48 1 Jan 01, 2005
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