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Solid State Technology

Volume: 48
Issue: 2
Date: February 01, 2005
LITHOGRAPHY SERIES, PART 1: Low-k1 imaging for contacts and lines using immersion ArF
Immersion lithography has the potential to extend current 193nm argon-fluoride technology to the 45nm process node by effectively reducing the wavelength of exposure light for improved depth-of-focus ...
Crucial applications addressed via fundamental ALD advances
The need for ultrathin high-k dielectric DRAM capacitors used in memory applications below 100nm, and for ultrathin high-k gate-dielectric materials in transistors at the 65nm node and b ...
Avoiding fire and explosion risks with proper H2 exhaust management
Hydrogen is used extensively in wafer fabrication processes for epitaxial deposition in silicon and compound semiconductors.
Selectivity/etch rate trade-offs in deep and high A/R oxide etching
Selective etching of silicon oxides relative to silicon or photoresist is achieved when the concentrations of CF+ and CF2+ ions in the plasma are optimized relative to ...
A new event for a ‘new’ industry
There’s lots of discussion these days about how technological complexity and global market forces have combined to apply continuous and heavy pressure on the profit margins of semiconductor manu ...
World News
Asian technologists’ 45nm outlook
III-nitride epitaxial growth with real-time access to wafer temp, ternary composition
In all epitaxial growth processes of III-Vs and related materials (MOCVD, MBE, CVD), an accurate control of the true wafer temperature is essential, primarily because the composition of key materials ...
Thermal budget reduction drives RTP beyond the 45nm node
Limits on thermal exposure are being driven by advanced node requirements and depend on the device’s physical state at any given point, as well as the kinetics of the undesired phenomena that ma ...
‘Design for manufacturing’ spreads
Solid State Technology asked design automation managers how DFM software is shifting the responsibilities for wafer yields.
Product News
China launches 300mm manufacturing
It was not long ago that China’s leading-edge integrated circuit (IC) manufacturing capability lagged behind the rest of the world by two or more generations.
The launch of Korea’s ‘new’ $1 billion chip company
October marked the official launch of MagnaChip Semiconductor Ltd., South Korea’s $1 billion semiconductor spinoff company and a milestone for the Korean chip industry.

Past Issues

2005

Volume Issue Date
48 12 Dec 01, 2005
48 11 Nov 01, 2005
48 10 Oct 01, 2005
48 9 Sep 01, 2005
48 8 Aug 01, 2005
48 7 Jul 01, 2005
48 6 Jun 01, 2005
48 5 May 01, 2005
48 4 Apr 01, 2005
48 3 Mar 01, 2005
48 2 Feb 01, 2005
48 1 Jan 01, 2005

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