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Solid State Technology

Volume: 48
Issue: 10
Date: October 01, 2005
Cu interconnects with Ru diffusion barriers
Extensive characterization of physical vapor-deposited ruthenium and RuxNy films was carried out to evaluate their performance as a copper diffusion barrier.
Creating shaped piezo silicon micropumps using MEMS-based manufacturing
Microelectromechanical systems (MEMS) technology is driving progress in the manufacturing of new “inkjetting” products called shaped piezo silicon micropumps.
A 90nm wafer-level technique for thin-film stress monitoring
Coherent gradient sensing (CGS) is an emerging thin-film stress metrology technique that provides a method to map wafer-level stress on both blanket and patterned films.
Using multiple transducers at sub-65nm for single-wafer megasonics-based cleaning
Wafer cleaning has traditionally relied on the combination of strong chemistries and high-power megasonic energy to achieve cleaning efficiencies >90%.
The big picture for nanotech
Few technologies in recent memory have generated more confusion than nanotechnology.
Technology News
The challenges of adjusting scaling control knobs
In 1965, Gordon Moore first observed an exponential growth in the number of transistors per IC and devised a law that threw down a gauntlet and, through intense competition, has enabled amazing gains ...
Nanometer deposition processes create new challenges for cryopumps
Every time cryogenic pumps are pushed to lower pressures in semiconductor manufacturing, new and often unexpected phenomena occur.
Product News
A major shakeup in reliability testing
If there is one grand truth in the semiconductor industry, it is this: Simple device scaling to achieve performance gains is dead.

Past Issues

2005

Volume Issue Date
48 12 Dec 01, 2005
48 11 Nov 01, 2005
48 10 Oct 01, 2005
48 9 Sep 01, 2005
48 8 Aug 01, 2005
48 7 Jul 01, 2005
48 6 Jun 01, 2005
48 5 May 01, 2005
48 4 Apr 01, 2005
48 3 Mar 01, 2005
48 2 Feb 01, 2005
48 1 Jan 01, 2005

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