300-mm ion implantation
The HE3, MC3, and ULE3 implanters are 300-mm tools for, respectively, high-energy, medium-current, and ultralow-energy applications. Covering the entire implant application range, they are extendible ...
Wafer Inspction station
The Optistation-V inspection system accommodates wafers up to 200 mm. The system provides very good optical inspection performance using brightfield, darkfield, differential interference contrast (DIC ...
Copper Interconnect deposition
Damascus Complete Copper is a complete range of equipment and processes designed to deliver production-worthy copper interconnect structures. The centerpiece of the system, which includes CVD and PVD ...
Rapid thermal processing
The RTP XEplus Centura rapid thermal processing system doubles the temperature ramp rate of its predecessor, the XE Centura, to 150?C/sec and reduces overall temperature variation to 3?C, 3s. The high ...
Is a discontinuity ahead?
Is a discontinuity ahead?
Growth industries often get on a steady track, with only incremental improvements. There may be ups and downs linked to the economy, and some competitors may grab up market share while weaker ones fal ...
Comparing semiconductor industries in Taiwan and China
Both Taiwan and China began to develop semiconductor industries at about the same time. From today`s view, Taiwan has been far more successful and is still growing dramatically. Despite China`s slow s ...
More Asian participation needed to develop global SEMI standards
William A. Brown, W. Murray Bullis, Semiconductor Equipment and Materials International (Semi), Mountain View, California
Silicon Island: A new landscape emerges
Taiwan is taking a very different path to a successful, fast-growing semiconductor industry than other Asian nations such as Japan, Korea, or potentially China. While officials and semiconductor execu ...
Shenzhen STS microelectronics
Shenzhen STS Microelectronics, Shenzhen, China, has inaugurated its state-of-the-art assembly and test plant and advanced full-custom design and development center. Situated at the Futian Free Trade Z ...
Toshiba Corp
Toshiba Corp. said it will help fund a new 64-Mbit DRAM assembly venture in Kaohsiung, Taiwan. Construction of the new venture, Walton Advanced Electronics (WAE), has begun, and assembly work is sched ...
Tokyo-based NKK
Tokyo-based NKK said its wafer processing facility in Ayase, Kanagawa Prefecture, will be closed by March 1999, and the firm will exit the memory business. The NKK line has a capacity of 6000 200-mm w ...
Applied Materials?
Applied Materials has donated a Precision 5000 CVD system to Nanyang Technological University in Singapore, where students will study chipmaking technology. The system has a market value of $1.5 milli ...
ESEC Asia-Pacific Pte. Ltd.
ESEC Asia Pacific Pte. Ltd., the Singapore-based subsidiary of Swiss multi-national ESEC SA, has signed a US$30 million contract to supply wire and die bonders to PT Astra Microtronics Technology for ...
South Korea?
South Korean press reports suggest that Dongbu Group has pulled the plug on its plans to build a DRAM fab utilizing IBM-developed technology. The scheme had been in the works for over a year, but bega ...
Spectra International
Spectra International, Morgan Hill, CA, a maker of in situ process sensors, optical spectrometers, and RGAs, has opened a new division, Spectra International Japan Co. Ltd., Akoh City, Hyogo, Japan. W ...
Selete?
The Japanese consortium Selete (Semiconductor Leading Edge Technologies Inc.) has purchased a serial process, high current ion implanter from Varian Associates Inc., Palo Alto, CA. Selete will use the ...
Marubeni Solutions Corp.
Marubeni Solutions Corp., Tokyo, Japan, will be the exclusive distributor in Japan of AVera, the CMP polishing tool of Aplex Inc., Sunnyvale, CA. Marubeni will offer its established support infrastruc ...
Worldwide highlights
Tool orders nearly flat. With order decline rates stabilizing, the semiconductor equipment market downturn may be close to hitting bottom, but signs of an industry recovery remain elusive. In its mont ...
USA
Intel Corp. has completed its $625 million buy of Digital Equipment Corp.`s semiconductor manufacturing operations. Intel will provide foundry manufacturing for multiple generations of Digital`s Alpha ...
Japan
NEC Corp. has given the official go-ahead on its next fab in the US, a 300-mm plant in Roseville, CA, where the company plans to invest $1.4 billion over the next four years. The fab will use a 0.15-? ...
Europe
Chip Supply Inc., Orlando, FL, has acquired the die assessment business of Rood Technology UK Ltd. (RTUK). Chip Supply will take over the RTUK die sales
Spherical semiconductors may become reality
Ball Semiconductor Inc., Allen, TX, is on target to manufacture semiconductors on 1-mm spheres and commercially produce them by 2000, according to executives. The company claims this approach has the ...
Maskmakers and lithographers need to "Just Do It"
Picking up a slogan dropped by sportswear manufacturer Nike, Kathy Cleveland of Lucent Technologies, says, "Our strategy has been to put together a `Just Do It` attitude. We have a mask utilization gr ...
SID 98: New FPD technologies catching on
While active- and passive-matrix LCDs for notebook computers still represent the vast majority of current flat panel sales, new display technologies should soon begin to enable many new end-uses. From ...
400-mm development on track
K. Takada, director of Japan`s Super Silicon Crystal Research Institute (SSi), said the first 400-mm CZ crystal growth furnace was installed last October and a second one will be in place in 1999 at S ...
Effectiveness of water-based flourine scrubber proven
Recent development work has shown the viability of water scrubbing, with and without a non-caustic additive, for treating corrosive fluorine gas effluent and essentially eliminating the potential of p ...
SLDRAM designing underway at MOSAID
International consortium SLDRAM Inc. has signed a contract with MOSAID Technologies to design the open standard that will establish the next generation of solutions for computer memory. MOSAID is an i ...
Study shows DeviceNet widely adopted
A recent user study by industry analyst Venture Development Corp. (VDC) reports extensive and expanding adoption of DeviceNet - the sensor actuator bus adopted by a large percent of semiconductor manu ...
Army grant for artificial eye
The University of Michigan College of Engineering has been awarded a $1.6 million US Army grant to design an artificial eye on a microchip - an optoelectronic device capable of sensing and processing ...
Japan firm to slash investment
After posting a disappointing 12 months, the Top Ten Japanese chipmakers expect their semiconductor sales to rise about 4% in the current fiscal year, which began April 1, but intend to make a sharp 2 ...
SGS-Thompson plans 300-mm R&D line
With about $1 billion in investments at hand, SGS-Thomson is planning to build a 300-mm pilot line beginning next year in Crolles, France, and a new nonvolatile memory pilot line in Italy that will se ...
ESEC ends the year with sales up
With its semiconductor placement (SCP) unit continuing to drive company growth, Cham, Switzerland-based final assembly equipment maker ESEC Group said it saw net sales climb to CHF 478.6 million ($341 ...
Mask technology challenges and 230-mm reticles
Semiconductor lithographers have for years been pressuring mask fabricators to provide larger, 230-mm (9 in.) reticles for the purpose of increasing productivity. However, when faced with the choices ...
People Update
Two top executives at KLA-Tencor, San Jose, CA, have swapped jobs. KLA founder Ken Levy, who has been chairman, will assume the CEO title, while CEO Jon Tompkins, who had been Tencor`s top manager, wi ...
Semiconductor seminar
A "Semiconductor Processing Overview Seminar" will be presented on Monday, September 14, 1998, 9:00 am to 5:00 pm, at the Pacific Athletic Club in Redwood City, CA. Topics to be covered include indust ...
IC fab/lithography tutorial
"The F & F IC Fabrication & Lithography Tutorial" is a two-day, in-house training presentation designed to keep fab personnel, new engineers, and technical managers up-to-date by enhancing their under ...
Laser-marking center
A new outsourcing service for the UV laser-marking of surface-mounted devices has been established for companies in the microelectronics industry. The center`s initial focus is on the marking of ceram ...
European Semiconductor Report
The European Semiconductor Report: 1995-2003 analyzes the economic environment in Europe, the semiconductor applications market, semiconductor production and capacity, market trends, and forecasts. Co ...
Material safety data sheets retrieval
Material safety data sheets (MSDS) to promote safe handling of a line of gas products are available 24 hr/day, 7 days/week via Internet, e-mail, CD-ROM, or customer service representative. MSDS on the ...
Origin of "stuffed diffusion barrier"
I enjoyed reading "High-throughput W/Ti barrier sequential deposition" (June, p. 127). It should be noted that the authors failed to cite the prior papers that discussed in depth the method they autho ...
Literature
This brochure describes an Equipment Technology Group`s expertise in designing custom gas delivery systems. As the brochure demonstrates, the manufacturer develops the systems from concept to installa ...
Automatic UV curing system
The UH201 automatic UV curing system provides a highly controlled environment to assure uniform UV exposure of wafers up to 200 mm. The UV adhesion process gives easier post-saw die removal than with ...
KGD test/ handling
The MP650 combines automatic bare die handling with multiple levels of vision inspection and up to five test stations, for sequential, parallel, or combined testing. It accepts standard frame-mounted ...
Failure analysis/quality control
Plasmalab?Etch - a fully integrated, software-controlled, dual-mode platform for use with full wafers (up to 200 mm) or packaged chips - allows the choice of etching in PE mode or in RIE mode. This ma ...
End-of-line inspection
The LS-7700, designed for end-of-line mechanical inspection of semiconductors, features inspection versatility for all major part types, including CSPs; in-tray scanning; SmartScan sensor technology f ...
TEOS sensor
This TEOS sensor - for the Model 4500 SensorStik detector - is based on field-proven electrochemical sensor technology, providing rapid response and the ability to alarm at lower levels than pyrolizer ...
High purity CO2 delivery
Precision Clean/Continupure is a high-purity bulk CO2 delivery system that has been developed for surface cleaning applications, and is delivered on a surface to be cleaned by such equipment as the AT ...
Teflon encapsulated fiber optics
These plastic and glass fiber optic assemblies are encapsulated in FEP Teflon to withstand harsh chemical environments such as the severe acid baths used in semiconductor applications. They also withs ...
cleaning and drying system
This cleaning and drying system for 300-mm FOUPS, Capsil, and Crystalpak shipping containers uses DuPont`s Vertrel solvent azeotrope, a nonflammable, environmentally friendly solvent that meets or exc ...
Multiuse heated stage
Model 855 is a standalone heated stage that is suitable for such applications as wire bonders and flip chip placement systems. It is a compact 4 ? 4 in. and has its own stand and power cord, as well a ...
RF power delivery system
The Apex 13.56 MHz RF power delivery system provides power repeatability, high reliability, and low cost through the integration of the 13.56 MHz power amplifier, impedance match, and VI probe. The si ...
Multizone temperature controller
The PPC-2000 is a multiloop PID controller with built-in programmable logic functions, for control of multiple processing zones from a single, compact unit. The modularized instrument allows multiple ...
Large-area extrusion coating
The FAS-Coat moving head extrusion coating system, for PDP, HDI, and AMLCD applications, coats substrate sizes up to 1200 ? 1600 mm. Because the extrusion head moves over the substrate, rather than th ...
microfilter
Chemdyne 0.04-?m absolute-rated membrane filters - for filtration of photoresists, etchants, and solvents - offer very low extractables levels, especially for metal ions such as sodium, calcium, and t ...
Particle size analyzer
The Ultrasizer uses acoustic attenuation spectroscopy rather than an optically based system for particle size measurement; it is effective in monitoring particle distributions in CMP slurries. Sound w ...
noncontact air-gap CV technology
The SSM 3000 Nano GAP CV system measures CV and Ct characteristics using a noncontact, nondestructive air-gap CV sensor. Capable of monitoring 200- and 300-mm wafers, it includes a measurement chamber ...
Portable emission microscope
The FA-1000 is a portable and modular emission microscope for failure analysis. It can be used in the lab or wheeled to the test floor and quickly interfaced with a wide range of testers. The optics a ...
High-vacuum pendelum valve
Series 65 pendulum valves have virtually particle-free operation for pressure control throttling and isolation in etch and CVD processes, and feature a stepper motor-driven gate that pivots in-line wi ...
CMP system
The PM300 APOLLO CMP system, dedicated to 300-mm wafer processing, features automatic process control, automatic wafer rework, stress-minimized dry-in/dry-out wafer processing, spinless drying, and re ...
Bulk chemical delivery
These bulk chemical delivery systems are offered in two models: recirculating, multipass filtration, and single-pass filtration. Numerous use points can be supplied from either system, and both off ...
Wafer-handling prealigner
The Per4Mer 3000 prealigner provides accuracy in all wafer-handling applications and offers direct support for the Per4Mer series robots. It locates SEMI standard flat or notched wafers with an angula ...
Lithography process station
The Millennium 2000 photolithography process station is a track system that is available in configurations for apply, bake or develop. It processes wafers from 2 to 8 in.; footprint is 19 ? 66 in. Des ...
Defect modeling software
Electron Flight Simulator software, version 3.1, improves the accuracy and quality of defect analysis in the SEM and DRT. It shows how the electron beam interacts with defects in the SEM/DRT and helps ...
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