Silicon-rich-methacrylate bilayer resist for 193-nm lithography
Andrew Blakeney, Allen Gabor, Daniela White, Thomas Steinh?usler, Olin Microelectronic Materials, Providence, Rhode Island, William Deady, John Jarmalowicz, Roderick Kunz, MIT Lincoln Laboratory, Lexi ...
High-throughput W/ Ti barrier sequential deposition
A newly developed in situ W/Ti deposition process, using a pulse of dry air between sequential deposition steps, achieves the same barrier properties as those from conventional processing with two sep ...
RTP technology for tomorrow
Current trends in the semiconductor industry influencing the future of RTP technology include the migration to smaller device geometries, new materials, thinner films, shallower junctions, and large a ...
DUV and i-li ne steppers
The FPA-3000EX5 DUV stepper has a projection lens with an NA of 0.63 and easily resolves 0.22-?m features over an exposure area of 22 ? 22 mm with conventional photo processes. Optical performance ext ...
300-nm wafer marking
The Waferlase Ultra 300 is designed for pilot or production marking requirements of 300-mm wafers; it is based on the proven Lasertech laser technology, field-tested on some 6000 marking systems world ...
Dry-in/dry-out planarization
The Auriga C integrated dry-in/dry-out planarization system polishes and cleans wafers in the same footprint as existing dry-in/wet-out tools. The five-head polish tool meets stringent performance req ...
Microlithography cluster
The Polaris 2500 microlithography cluster has been designed for the needs of 0.18-?m photoresist processing. The thermal process stations are packaged in six bake/chill and prime/chill pairs, vertical ...
RTP polysilicon deposition
Designed for rapid thermal process (RTP) polysilicon deposition, the Epsilon 2500RTP uses silane as the silicon source gas and hydrogen as the carrier gas, a combination that yields good performance a ...
300-mm wafer surface analysis
Developed specifically for 300-mm wafer analysis, the VCA-3000mp provides fully automatic video contact angle analysis to test critical wafer surface conditions during multiple stages of the semicondu ...
FIB/SEM workstation
The DualBeam XL860 FIB/SEM workstation features robotic sample handling and active environment compensation, combined with very high-resolution SEM imaging and rapid, precise FIB milling. It is design ...
PVD system
The Sigma fxP PVD system clusters mature Sigma process modules around an eight-sided, high-throughput platform. It achieves >300 hrs MTBF and >90% uptime thanks to a clampless processing philosophy an ...
300-mm foup
The SMIF-Pod 300 front opening unified pod (FOUP), a reliable and cost-effective wafer carrier solution for 300-mm wafer fabs, meets the needs of =0.18-?m devices and offers good seal performance, pro ...
Post-etch polymer and residue removal
These noncorrosive photoresist strippers/polymer removers are formulated for sub-0.5-?m IC processes incorporating high-density plasma etch. The PRx-400 removers dissolve hard-to-remove inorganic poly ...
PVD for copper interconnect
This PVD system for copper interconnect and wiring of advanced damascene structures, the Zi-3000, is an ultrahigh-vacuum (10?9 torr), eight-chambered cluster tool that is used for sequential depositio ...
300-mm EPI system
The Epi 300 is a single-wafer multichamber system that grows slip-free epitaxial layers on 300-mm wafers. Based on the proven radial technology of the 200-mm Epi Centura, it minimizes the risks of tra ...
White vibration filtering for equipment and facilities
Virtually every facet of the semiconductor industry pays a price (in investment and revenue) for vibrations, which increase the cost of wafer fab construction and impede improvements in lithography, m ...
the Physics of metrology instruments
Metrology is growing in both complexity and breadth, as more technologies are brought to bear on the increasingly difficult problems faced by the process engineer. As IC parts shrink, metrologists are ...
Ion implant equipment challenges for .18 um and beyond
David W. Duff, Leonard M. Rubin, Eaton Corporation, Semiconductor Equipment Operations, Beverly, Massachusetts
Pyrogenic wet oxidation by RTP
A pyrogenic burner in a conventional RTP system produces H2O gas for the enhancement of oxide growth in a wet rapid thermal oxidation (WRTO) process on bare silicon and implanted wafers. We determined ...
The lithography crsis is now
The 1997 SIA Roadmap for future semiconductor manufacturing poses some extraordinary near-term challenges for wafer lithographers and maskmakers. Put bluntly, the lithography/reticle guidelines for cr ...
SW preview
This year`s SEMICON West will offer more than 70 technical programs and courses, 35 of them new. Just like last year, the programs are divided between San Francisco and San Jose, with front-end wafer- ...
System-On-a-Chip changes everything
With system-on-a-chip (SOC) technology (System LSI in Japan), the entire electronics industry appears to be on the verge of a radical transformation. Chips with 0.35-micron linewidths are becoming com ...
news update
The SMIF-Pod 300 front opening unified pod (FOUP), a reliable and cost-effective wafer carrier solution for 300-mm wafer fabs, meets the needs of =0.18-?m devices and offers good seal performance, pro ...
News update
These noncorrosive photoresist strippers/polymer removers are formulated for sub-0.5-?m IC processes incorporating high-density plasma etch. The PRx-400 removers dissolve hard-to-remove inorganic poly ...
News update
This PVD system for copper interconnect and wiring of advanced damascene structures, the Zi-3000, is an ultrahigh-vacuum (10-9 torr), eight-chambered cluster tool that is used for sequential depositio ...
news update
Teres is a dry in/dry out chemical mechanical planarization (CMP) system that integrates a rotary buff station for surface modification/defect removal, an integrated post-CMP cleaner that uses On-Trak ...
News Update
The CBT 6000 high-speed thermosonic ball bonder performs wire bonds and interconnects for hybrid and MCM applications. With a large work area (6 ? 12 in.), the tool features a dual-lane part feeding ...
News Update
Model 8860 is a stable and compact station for sub-?m semi-automatic probing. It is modular and can be configured with options that include integrated, shielded and dry environments, triaxial chucks a ...
News Update
Designed to process III-V material, thin silicon, sapphire, glass, and ceramics, the LSD-100 integrated scribe-and-break (100 mm) wafer dicing system has a throughput of approximately 120,000 unifor ...
Worldwide highlights
North American equipment companies saw February orders drop 5.4% from January levels. SEMI noted that North American equipment vendors had a book-to-bill ratio of 0.92 in February, with three-month av ...
USA
Varian Associates has agreed to purchase Genus Inc.`s high-energy ion implant product line in a deal worth
Japan
Weak orders for Japanese tool vendors. Japanese equipment companies logged total January orders (including exports) of 87.7 billion yen ($681 million), 31.4% below year-ago levels, according to the Se ...
Asia/Pacific
Taiwan`s Tatung Group, Taipei, is planning to establish a chipmaking operation in the region, and is hoping the business will generate 100 billion Taiwan dollars (US$3.5 billion) annually, according t ...
Europe
Asian financial problems that arose late last year led to several changes in the overall industry and in the Top Ten rankings (see table), according to a study by VLSI Research Inc. A recession in Asi ...
Sematech team makes 100-nm features
New results from a SEMATECH lithography research program suggest that current-generation 248-nm deep ultraviolet wavelengths can generate well-controlled 100-nm (0.1-?m) features on the wafer, using a ...
Copper plus low-k damascene built at TI
Texas Instruments (TI), Dallas, TX, has announced a viable copper wiring technology for IC fabrication. TI joins the ranks of IBM and Motorola, which have both made early introduction of "copper techn ...
Two Semi groups discuss 9-in. reticle carriers
As the maskmaking industry works to implement standards for the transition to 9-in. reticles, two SEMI task forces charged with designing carriers for the larger glass substrates have taken divergent ...
new high-k material from Bell Labs
A group of Bell Labs researchers has developed a new zirconium-tin-titanium oxide material with a high dielectric constant that may become a contender for use in capacitor and gate oxide structures in ...
New 193-nm resist resolution to 60 nm without phase shift
A research group at Hyundai Electronics Industries (HEI) in South Korea has demonstrated the ability to print 60 nm (0.06-?m) isolated lines using a new single-layer 193-nm photoresist and traditional ...
H2O2 cleaning stabilizes reference wafers
New data suggest that hydrogen-peroxide (H2O2) cleaning of a bare-silicon reference wafer before use for ellipsometry calibration ensures a repeatable native-oxide surface and reliable measurement res ...
Move to 230-mm reticle now on back burner
With critical level 230-mm (9-in.) reticles forecast to cost at least three times as much as today`s 150-mm masks, the need for the larger reticle size is being pushed out about a year, according to a ...
Mitsubishi to cut capital spending
Expecting huge losses in its chipmaking business for the previous fiscal year, Mitsubishi Electric, Tokyo, will cut FY98 capital investments to 50 billion yen, down from 90 billion yen last year, and ...
Japans poly production skyrocketed in 1997
Japanese suppliers of polycrystalline silicon had a boom year in 1997, boosting their production by a whopping 30.9% over 1996 levels, and shattering production forecasts made at the beginning of last ...
NEC and Matsushita plan PDP production
With PDP (plasma display panel) demand expected to rise in the next four years, NEC, Tokyo, will ramp production of the displays beginning this month, a move followed by Matsushita Electronics, Osaka, ...
Europe is speeding up R&D in deep submicron processing
With the increased globalization of economies and the finalization of a true unified European economic region, the European market becomes a very attractive business playground. Europe consumes 21% of ...
Improving wafer yields at low K1 with advanced photomask defect detection
When the optical resolution is comparable to the illumination wavelength, small variations in photomask dimensions cause disproportionately large changes in wafer CDs. Photomask CD errors =75 nm can p ...
Advanced IC packaging and market trends
Advanced IC packaging strives to further industry goals of reducing the amount of space consumed by electrical components while increasing system performance.
People update
Sanyo Electric, Osaka, Japan, has appointed Sadao Kondo president effective June 26. He was executive managing director and semiconductor sector head.
Gold wafer bumping
A service featuring automation and efficient manufacturing processes, located in Hsinchu Science-based Industrial Park, offers gold wafer bumping to LCD display driver, COG, and TBGA users. The compan ...
Electrical Characterization facility
A technical support and training facility for the electrical characterization of semiconductors has been established at the Technical University Chemnitz, Dresden, Germany, by a US-based company. The ...
Microchip fabrication volume
Microchip Fabrication: A Practical Guide to Semiconductor Processing, 3d edition, covers material science, maskmaking, contamination control, chemistry, math, and state-of-the-art processes used in wa ...
Custom metal fabrication
Specialized metals and materials fabrication services are available to research scientists and design engineers from a company that supplies these substances for research or prototype development. Ser ...
Tool Cleaning
This service specializes in cleaning semiconductor tool parts using environmentally safe technologies. Outsourced cleaning enables device manufacturers to reduce COO. Based in Albuquerque, NM, the bus ...
Filtration lab services on web
Information on Scientific and Lab Services (SLS) for filtration and separation technology is available on this company`s web site. Designed to assist customers in specific aspects of their processes, ...
FIB service support center
This center is designed to provide technical assistance to the customers of a focused ion beam (FIB) system supplier. The center`s help desk is staffed by trained representatives who assist field serv ...
Stepper
This cleanroom compatible CD-ROM contains operator manuals, system schematics, and other reference materials for stepper documentation. It enables lithography technicians and equipment engineers in cl ...
Lithography support Programs
In response to the industry shift to DUV lithography, a US-based company is increasing its technical support options. The service program will expand off-hours response up to 24 hr/day, seven days/wee ...
1998 Semi Education catalog
This edition of the SEMI education catalog describes courses on cultural awareness, business marketing, and technology. Specific topics include doing business in Korea, Taiwan, Singapore, Japan, and C ...
Soft simulation crucial for new automated fab decisions
Software-driven simulation is a valuable tool for those evaluating and choosing automated material handling systems (AMHS) for new wafer fabrication facilities. While this approach is just a simulatio ...
Using GEM to measure equipment utilization
Relatively few equipment engineers know the advantages of the "process state model" in Semi`s generic equipment model (GEM). In all equipment shipped with this compliance, GEM provides a straightforwa ...
Letters update
We were very pleased to see the article in Technology News that reported on the potential for JVD nitride for ULSI technology ("Jet vapor deposition reduces gate leakage," April, p. 36). The data in t ...
Letters update
It was with great interest that I read your article on "Efficient new VUV light source," (February, p. 30).
Letters update
With design rules getting smaller and smaller, Solid State Technology will be translating microns to nanometers more frequently. A reader pointed out that the metric conversion was expressed incorrect ...
Literature
Ceramic-to-metal and glass-ceramic components for ultrahigh vacuum applications are highlighted in this six-page, four-color brochure. Ceramic-to-metal components are designed to withstand demanding m ...
Die Bonder
Model 4500 is a multichip epoxy die bonder that features dispensing and stamping capability, multiple stamping, pick-and-place and eject tools, die input from frames, rings, waffle or Gel-Packs, 8-in. ...
Flip chip placement
The Micron SC is a high-performance flip chip placement tool that is based on frictionless air bearings and ceramic x-y beams supported on a granite base, allowing 10-?m placement accuracy at 3s. It p ...
Bumped Wafer Characterization
The WS-1000 is a bumped wafer characterization system that offers throughput up to 15 wafers/hr with 1-?m measurement repeatability. User-defined SPC charting allows real-time monitoring of bumping pr ...
RTP system
The AST 3000 rapid thermal processing system - for 200- and 300-mm wafers - is designed for high-volume production of 0.25- and 0.18-?m device generations. Applications include silicide formation, imp ...
Wet Processing station
These automated, semi-automated, and manual wet processing stations offer a computer-based touchscreen control system, available with data logging, tracking, coding, scanning, and real-time charting c ...
Atmospheric pressure cluster system
Designed for photoresist stripping and simple etch processes, the Titan atmospheric pressure cluster system incorporates the field-proven Genmark 3-axis robot, two inductively coupled plasma process m ...
Post-etch residue removal
EKC325 is an aqueous organic post-etch residue remover for sub-0.25-?m processes in which electrical CDs are critical. The formulation removes hard-to-clean organic and metallo-organic polymers that a ...
Load-locked etching system
The RIE-200 iP load-locked etching system uses the latest inductively coupled plasma technology to perform high-speed, 0.25-?m etching of the thin films used in ULSI processing. The system allows the ...
ECR Plasma cleaner
The PlasmaQuest Series Ii high-density ECR microwave enhanced plasma source achieves low surface contact angles and high organic etch rates, uniformly processing a 4-sq-ft area in minutes. Application ...
Fiber optic infrared thermometer
The M680 multichannel fiber optic infrared thermometer provides noncontact temperature sensing in such processes as RTP, CVD, PVD, plasma etching, epitaxial reactors, and crystal growing. Its high-spe ...
Photon ionizer
Model 4900 is a photon ionizer that is effective in extremely static-sensitive applications, tight spaces, and environments with no airflow. It uses a high flux of very low-energy photons, flooding wi ...
Brushless direct drive motor
GOLDLINE DDR (direct drive rotary) high-torque, brushless motors provide precise operation in a compact package. Rare-earth, neodymium magnets are used to generate high continuous and peak torque rati ...
Cleanroom Ceiling module
Suited to height-limited overhead installation, the MAX 8000 ceiling module is a low-profile unit designed for use in cleanrooms, softwall cleanrooms, and isolated clean areas. Height is 13.5 in. and ...
Tip Evaluation system
Available for all NanoScope Dimension and MultiMode scanning probe/atomic force microscopes, this tip evaluation system determines whether the tip meets a selected sharpness criterion or should be rep ...
SEM, TEM Preparation
This fully automatic solution for scanning electron microscope (SEM) and transmission electron microscope (TEM) cross-section preparation, straTEM, processes die and wafer segments with a throughput o ...
Semiconductor Spectrometry
The Magna-IR/ECO automated wafer profiling accessory offers users of the Magna-IR spectrometer the option of adding advanced wafer analysis capabilities to their systems. It can perform standard ECO a ...
Thin-film thickness mapping
The F50 thin-film thickness mapping system automatically measures the thickness of oxides, nitrides, resists, polymers, and other films used in III-V and LCD fabrication. Films between 20 nm and 30 ?m ...
Elemental analyzer
Using x-ray focusing optics and large-area Si(Li) detectors, the Eagle ?-Probe is designed to handle the largest possible array of elemental analysis applications. With an analytical spot size =100 ?m ...
Vaccum measurement system
The series 358 vacuum measurement system features the MICRO-ION gauge - the first all-metal ionization gauge - which is smaller and more rugged than a glass gauge. System features include dual CONVECT ...
Dry twin screws vaccum pumps
The Cobra line of dry pumps eliminates the need for N2 sealing or cooling. An indirect cooling system offers precise temperature control that can eliminate process condensation within the pump; and si ...
wafer transfer system
The E-8225 BB wafer transfer system reduces airborne contamination, improves reliability, and simplifies installation in new or retrofitted fabs by eliminating the need to run air lines to the equip ...
Crossover photoresist
AZ 3312 is a high-performance crossover photoresist that offers wide processing latitude in both g- and i-line exposures. In i-line, it is linear to 0.4 ?m and has an exposure latitude of 30% for 0.5- ...
Photoresist purity
LithoGuard is a small-footprint, modular unit that protects photoresists in DUV steppers and track tools by removing ammonia, amines, and other organics with high-efficiency activated carbon filters ...
UV light meter
Model 555 UV light meter is designed to provide =0.5% electronic error, a real-time emergency management system, and <2%, 3s calibration to NIST standards. Real-time measurements are displayed, replac ...
Reticle writer
The LRS 200 high-precision laser writer is targeted at semiconductor reticle sets down to 0.5-?m design rules and noncritical levels down to 0.25 ?m. The system also meets the requirements of TFT reti ...
Fast photospeed photoresists
OiR 672 and OiR 674 i-line photoresists perform at a fast photospeed of 130 mJ/cm2 - an optimal range for use with new i-line scanners. They offer a wide exposure latitude and depth of focus for 0.35- ...
Direct wrire laser lithography
The DWL400 is a high-accuracy direct write laser lithographic system for the production of high-resolution masks and direct write applications. It can image up to 16 ? 16 in. with sub-?m structure siz ...
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