Tungsten CMP process developed
Commercially available system hardware and consumables-sets produced well-characterized tungsten chemical mechanical planarization processes. Obtaining adequate tungsten removal rate selectivities to ...
PPT Purification elimination process variables
A composite of intercalate reactive metal compounds forms an integral part of the existing fibrous filter matrix to create a POU purification surface. The reactive sites are located on the stainless s ...
Optimal staffing in semiconductor manufacturing: a ueing theory approach
Equipment costs comprise more than 70% of the capital investment budget of a new semiconductor manufacturing or test and assembly facility. The advent of 300-mm manufacturing promises to push the over ...
Flip Chip package failure mechanism
Completely assembled flip chip packages are notoriously difficult to inspect for critical defects. Acoustic micro imaging tools with sophisticated electronic subsystems can identify the major types of ...
Haavind receives Crain Award for "editorial excellence"
The American Business Press has presented its 1998 Crain Award to Bob Haavind, Solid State Technology`s editor in chief. Bob accepted the award, given "for outstanding career contributions to the deve ...
worldwide highlights
Worldwide semiconductor sales took a hit in December, dropping 5.2% on a month-to-month basis to $11.48 billion, from $12.11 billion in November, with all of the world`s regional markets showing decli ...
USA
Veeco Instruments has agreed in principle to acquire Digital Instruments Inc., a Santa Barbara, CA, producer of scanning probe microscopes and atomic force microscopes. The deal is for 5.5 million sha ...
Japan
Fujitsu and Sony will share the costs of a new 100 billion yen ($787 million), 18-nm system LSI fabrication line to be built at Fujitsu`s Mie Plant, Mie Prefecture, near Nagoya. The facility is schedu ...
Asia Pacific
LG Semicon has entered a co-development project with Pohang University for its x-ray litho development program. The company completed the X-Ray Lithography Center in 1995, and thus far has invested 12 ...
Europe
Solid State Measurements Inc., Pittsburgh, PA, a designer and manufacturer of electrical testing equipment for the semiconductor industry, has formed SSM GmbH, a wholly owned subsidiary in Dresden, Ge ...
Semi meeting: slow 300-mm plans
IBM announced that it is backing off its 300-mm schedule, and the International 300mm Initiative (I300I) will accelerate equipment demonstrations in 1998, after a slower-than-hoped pace in 1997. The a ...
Jet vapor deposition reduces gate leakage
Engineers at Motorola have demonstrated reduction in gate leakage current and strong resistance to boron penetration when jet vapor deposition (JVD) nitride is used as a gate dielectric in an advanced ...
Patterned wafer defect binning
New tools for patterned-wafer defect inspection may enable the detection of excursions well before a process is out of control. Relying upon databases of defect categories, end-users should be able to ...
Value added from backend drives assembly automation
Today`s semiconductor manufacturing backend is a linear extrapolation of technology in place for 25 years. HC. Scott Kulicke, chairman and CEO of Kulicke & Soffa Industries stated that it has been "pr ...
Laser system personalizes 0.35-um gate array
A newly upgraded laser micromachining system provides rapid personalization of 0.35-?m gate array devices, with improvements of throughput and accuracy.
Asian Capital spending cuts seen
The Asian financial crisis is evolving on several fronts, with semiconductor capital spending plans in South Korea and Japan coming under heavy pressure even as stock markets in the two nations start ...
Llucent and chartered from joint venture in singapore
Lucent Technologies Microelectronics Pte. Ltd. and Chartered Semiconductor Manufacturing Ltd. have formed wafer manufacturing company Silicon Manufacturing Partners Pte. Ltd., a $1 billion joint ventu ...
Japans 300-mm Plans evolve
The advent of 300-mm wafers in Japan hit hard. Toshiba announced that it will postpone construction of its 150 billion yen fab in Oita, Kyushu, until 2000. NEC is still planning a 300-mm wafer pilot p ...
daewoo and SGS-Thompson open design center
Daewoo Electronics, Seoul, South Korea, and SGS-THOMSON Microelectronics, Paris, France, have agreed to establish a joint design center company in Seoul. The center will be used to develop ICs for exi ...
Fab for lease
In a joint effort, engineering and construction firm Meissner + Wurst and the Flanders foreign investment office (FFIO) are planning to build a $1.5 billion chipmaking complex in the northern Belgian ...
Semi in russia
This summer, Semiconductor Equipment and Materials International (SEMI) will again host the Commonwealth of Independent States (CIS) Executive Mission and Exhibit. This mission, running June 1-4, will ...
Applied materials to equip dresden fab
Semiconductor 300, the recently announced Siemens-Motorola 300-mm fab in Dresden, Germany, has placed a large, multi-technology order with Applied Materials, the semiconductor equipment supplier based ...
Test structure design: An opportunity for fab outsourcing
Fabs are becoming more comfortable with collaboration in certain, isolated areas, such as the growing field of test structure design. This field has evolved to become an essential tool for process eng ...
People Update
FSI International Inc., Minneapolis, MN, has named Thomas D. George to its board of directors. He recently retired from Motorola, where he served as president and GM of the Semiconductor Products Grou ...
etch/planarization seminar
This training class is part of a series of courses on advanced wafer processing developed by Integrated Circuit Engineering (ICE) for new and experienced technicians and engineers. Topics to be covere ...
Tubular heater shipment program
This program features quick shipment by a manufacturer for small quantities (1-12 units) of tubular heaters. The equipment can be shipped within 3-6 working days through the Tubular PLUS Program; equi ...
The film technology handbook
This book by Aicha Elshabini-Riad and Fred Barlow is a comprehensive resource on the preparation, characterization, and emerging applications of thin film technologies. Featured are extensive new adva ...
Service support center
This center is designed to provide technical assistance to the customers of a focused ion beam system supplier. The center`s help desk is staffed by trained representatives who assist field service en ...
SIMS profiling
This SIMS depth profiling service is aimed specifically at low-energy implant qualification and thin layered devices. Using impact energies as low as 100 eV, Applied SIMS Profiling offers a depth reso ...
1998 Semi education catalog
This edition of the SEMI education catalog offers courses on cultural awareness, business marketing, and technology. Specific topics include doing business in Korea, Taiwan, Singapore, Japan, and Chin ...
1998 MRS catalog
This catalog provides a listing of books, videotapes, journals, and periodicals available through the Materials Research Society (MRS). Topics in electronic materials and processing include beam proce ...
IC manufacturers reference
This publication titled Strategic Reviews provides detailed profiles of approximately 200 IC manufacturers and suppliers. Each company review features an account of key management personnel, financial ...
Literature Update
This full-color brochure describes a line of filters available in 3-, 5-, and 11-in. lengths for ultra- high-purity gas filtration requirements. Each housing of the
Diesorting and tape/reel output
The DS-7000 T/R features high-speed multisorting capability via wafer mapping or ink dot recognition. An intelligent vision system ensures precise wafer and die alignment. Output is to embossed cavit ...
Plasma chip carrier cleaner
n this chip carrier cleaning process, the carriers stay in the magazines for cleaning. Just one cleaning step is required after die bonding because the plasma process has a long-term effect. After cle ...
Closed ion source gas analyzers
Model C230 high-output, low differential pressure transmitter, designed for wet/wet differential pressure measurements of gases and liquids, has been enhanced to offer pressure ranges from 0-1 psid to ...
Differential pressure transmitter
This company`s hazardous and toxic gas monitors now interface with Sierra Monitor`s Model 8000 communications bridge, a link that eliminates the need for expensive hardwire interfaces. The bridge redu ...
Toxic gas monitoring
Mass-Trak measures and controls gas mass flow rates at low cost, in analytical, laboratory, and OEM instrument applications. Its on-board display and local setpoint potentiometer allow for adjustment ...
Mass flow controller
The CIS series closed ion gas analyzers offer better than 1 ppm detection limit for all gases and direct sampling at mtorr pressure. A real-time Windows software package is provided for on-line proces ...
FTIR thin-film in situ monitor
IRon-Line is a compact, robust and fast FTIR spectroscopic reflectometer for rapid, in situ, and real-time measurement of thin-film sample properties. It delivers information on evolving sample proper ...
RGA process monitoring
The Vision 1000-P RGA process monitor, which consists of a compact Smart Head RGA with a PVD ion source and close coupled inlet, provides a simple go/no go display. Fault conditions or deviations from ...
Furnace series
NOBLE wafer-processing furnaces consist of three series. (Single or multiple stacks are available for all diffusion and LPCVD applications.) The IPS Series 26 is a complete furnace processing system w ...
CO2 snow precision cleaning
The Eco-Snow "dry" cleaning process, with applications ranging from semicon-ductors to FPDs and disk drive media,uses liquid CO2 to remove submicron particulates, thin organic films, and photoresist r ...
Endpoint control for CMP tools
OPTIMA 9300 is designed for real-time, in situ, nonintrusive, layer-independent endpoint control for oxide, STI, and metal semiconductor layers for CMP tools. It incorporates dynamic signal process te ...
Residue removal buffer
This new option for the PEP Package Solution, which was developed for the strict requirements of critical post-etch residue removal and photoresist removal process steps, is designed for =0.25-?m geom ...
CMP slurry system
The MEGAjet mixing system is designed for correct blending of slurries that are challenging to dispense while maintaining a uniform suspension of the abrasive. Inside the tank, patterned flows are cre ...
Cold cathode gauge controller
The Series 943 digital controller measures from medium to ultrahigh vacuum pressures. It operates the I-Mag gauge or the series 421 cold cathode gauge with a measurement range of 10-2 to 10-10 torr, a ...
Wafer cleaning systems
Omega2000 and Omega4000 advanced wafer cleaning, rinsing, and drying systems are designed to process very large substrates, including 200- and 300-mm wafers and FPDs, while providing particle reductio ...
Recirculating cooler
The benchtop RS33LT recirculating cooler offers a range of temperatures from -40 to 75?C, stable temperature control to ?0.1?C, and an RS232 computer interface. It will recirculate most industry stand ...
Peltier cooled assemblies
This new series of 2508-T8 assemblies includes a bead-type thermistor (2.2 kW) and a thermoelectric cooler (MC-series) mounted on a TO-8 (TO-5) header. At an active heat load of 0.1 Wt, it provides a ...
200-nm process tank
This 200-mm process tank is injection-molded from very high-purity material; single and dual capacity tanks are available. Features include a smooth surface finish that is nonabrasive and easy to clea ...
SMIF wafer sorter
The MVT 7080 SMIF wafer sorter quickly and safely sorts, splits, merges, or randomizes 75- to 200-mm-wafer lots at rates up to 300 wafers/hour. The system features: a four-axis robotic handler with an ...
Surface profiler
The WYKO SP3000 surface profiler expedites process control of large-format samples with accurate, noncontact 3-D data. Designed to enhance yield and improve in-line process monitoring of flip-chip pac ...
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