Sia Update
This is the third and final installment of Solid State Technology`s review of the Semiconductor Industry Association`s (SIA) 1997 National Technology Roadmap for Semiconductors (NTRS). Chief Technical ...
reducing defects to manage Yield
Charlie Gross, Digital Semiconductor Hudson, Massachusetts David Jensen, Advanced Micro Devices, Austin, Texas
Assembly and Packaging Challenges
In the development of the 1997 edition of the NTRS, the Roadmap Coordinating Group recognized the dramatic change in the Overall Roadmap Technology Characteristics since the 1994 edition. The needs fo ...
Design and test: Getting a handle in productivity
Since the 1994 Roadmap, there has been a further realization of how fast the gap between what we can design and what we can build is growing.
New models to increase capital effectiveness
With $2 billion fabs just over the horizon, it`s time we took a closer look at our capital effectiveness. Can we afford expenditures on this scale? The new markets that we hope to create certainly can ...
Processing and integration of copper interconnects
Robert L. Jackson, Eliot Broadbent, Theodore Cacouris, Alain Harrus, Maximillian Biberger, Evan Patton, Tom Walsh, Novellus Systems, San Jose, California
Focused Ion beam mask repair
In the late 1980s, the move to reduction lithography - instead of 1? lithography - gave mask equipment and process developers a vacation [1]. Now that the linewidths on advanced photomasks are reachin ...
Can overall factory effectiveness prolong Moores law
Gordon Moore of Intel first articulated the law that has governed the success of the semiconductor industry since its inception: chip performance doubles every 18 months at no additional cost to custo ...
Mask Aligners in advanced packaging
New packaging technologies, developed to support the increasing functionality and performance of today`s and future IC generations, increasingly use photolithography for the fabrication of high-densit ...
SemiconEuropa
SEMICON Europa is an international exposition and conference for semiconductor equipment, materials, and services. Sponsored by SEMI, the 23rd annual SEMICON Europa offers exhibits, technical conferen ...
A few bad apples
Last SEMICON West, I talked with a mainstream TV reporter in the press room. This intrepid newshound had heard that dangerous chemicals were used in the manufacture of semiconductors, and wanted to kn ...
World Highlights
Semiconductor sales up in November. World semiconductor sales hit $12.10 billion in November, a new high for 1997, but marginally surpassing October sales by $113 million, according to the Semiconduct ...
USA
Eaton Corp., Cleveland, OH, has earmarked $92 million for fab tool operations. At its semiconductor equipment operation headquarters in Beverly, MA, the company is spending $75.7 million to build a 11 ...
japan
Tokyo Electron Ltd. (TEL) is purchasing the assets of the Sony subsidiary Materials Research Corp.`s Semiconductor Equipment Division, including the related PVD/CVD technology, for an undisclosed sum. ...
Asia/Pacific
China may be moving ahead on its promise to eliminate tariffs on information technology products, according to Japan`s Nihon Keizai Shimbun newspaper. Government sources indicated that the measures, w ...
Europe
Dainippon Screen Deutschland GmbH has opened a new DM 2.5 million ($1.4 million) spin scrubber production facility and training center in Dusseldorf, in an effort to improve customer service in Europe ...
Wet Bench materials scrutinized after fires
Spurred on by new fire safety protocols from the insurance industry, and by the recent rash of devastating fab fires in Taiwan, chipmakers and equipment suppliers are taking a hard look at wet bench s ...
Double gets Mosfet demonstrates 25-mm thick channel
As feature sizes continue to shrink, researchers are proposing new transistor designs in order to maintain electrical properties. The double-gate MOSFET is one such approach. According to Hon-Sum Phil ...
New Transistor replicates neurons
Frogs are stupid. They can`t calculate digits of p, they can`t transmit data over long distances, they have no grasp of most problems that an average desktop computer considers routine. Yet, as a fly ...
Applied materials copper roadmap
Applied Materials recently issued its roadmap for copper interconnect technology, and announced that it plans to offer an entire suit of process solutions over the next several years. In a first move, ...
Laser system Personalizes 0.35-um gate array
A newly upgraded laser micromachining system provides rapid personalization of 0.35-?m gate array devices, with improvements of throughput and accuracy.
Japan may lead financial downtown in 1998
At SEMI`s 1998 Industry Strategy Symposium, Pebble Beach, CA, discussions of the uneasy financial conditions in Japan and South Korea dominated conversation.
Japanese display manufacturers lower estimates
Sluggish sales of personal computers in the Japanese market have resulted in lower-than-expected sales of flat-panel displays for computer applications, and as a result, leading FPD producers have bee ...
Sumitomo Metal merger
Sumitomo Metal Industries is planning to merge operations with its wafer-making subsidiary, Sumitomo Sitix, and will fund a new 50 billion yen ($377 million) plant in Imari, Saga Prefecture, Kyushu Is ...
I - line step-and-scan
The PAS 5500/400 is an i-line step-and-scan system that can process ninety-six 200-mm wafers/hour. It is designed to work in conjunction with the PAS 5500/500 deep-UV step-and-scan system, providing a ...
Cathode for FPD production
The Move Mag cathode, with a moving magnet arrangement behind the target, doubles the previous target utilization values for the ARISTO in-line sputter system, allowing low-particle, high-volume produ ...
Spin etchers
The "Spin Etcher Front Master" is used for versatile frontside applications such as post-CMP cleaning, oxide removal/thinning, structuring (oxide, silicon, aluminum), polysilicon etch, polymer removal ...
Metrology software
Version 4.0 of WAFERMAP software allows import of data files from metrology tools such as ellipsometers and four-point probes. The data can be visualized by contour plots, 3D plots, line scans, and hi ...
In-line digital display
The Model LD330 is a digital display that has a low-power, 3.5 digit (0.3 in. H) analog-to-digital converter with an LCD display. Its footprint is 1.5 ? 1.5 ? 1.65 in. (W, D, H), and its integral bayo ...
Double-head diebonder
The PPS 2300 series double-head diebonder is customized for such applications as leadframe, MCM, and BGA. Each module is equipped with two bonding heads, either with a dispensing, stamping, or pick-an ...
SOI 300-mm wafer
SOI (silicon-on-insulator) wafers are a strategic step in silicon wafer engineering for advanced ULSI applications, giving better performance for low-power and low-voltage applications, as well as an ...
Dry pumps
The iL70 drypump, targeted at clean processes, is designed for loadlock, transfer chamber, PVD, SEM, and similar applications. The iH1000 heavy-duty oil-free pump provides high-speed pumping for diffi ...
Poly-etch system
The TCP 9400PTX etch system is optimized for such applications as advanced poly/polycide gate etch and shallow trench isolation for 0.18-?m technology. It is configured for the Alliance platform, whic ...
Peltier cooled assemblies
This new series of 2508-T8 assemblies includes a bead-type thermistor (2.2 kOhm) and a thermoelectric cooler (MC-series) mounted on a TO-8 (TO-5) header. At an active heat load of 0.1 Wt, it provides ...
Siemens and Motorola in German joint venture
Cadence Design Systems Inc., a supplier of semiconductor design technology and services, is to establish its next-generation system-on-chip design facility in Livingston, Scotland, creating as many as ...
Cadence invests in Scotland
Cadence Design Systems Inc., a supplier of semiconductor design technology and services, is to establish its next-generation system-on-chip design facility in Livingston, Scotland, creating as many as ...
MEDEAs lithography project
Work is progressing on post-193-nm, ion-projection lithography (IPL) under Europe`s MEDEA project. The governments of Austria, Germany, and The Netherlands - and several companies - are taking equal f ...
LETI and Leica develop lithography process
The LETI/GRESSI R&D lab in Grenoble, France, is working in conjunction with Leica Lithography Systems to develop a hybrid lithography technique that will combine the speed of a DUV stepper with the re ...
300-mm: How will production software keep up?
As a semiconductor fabrication company manager or employee, what would you do to ensure everything was processed correctly if a single batch of product through a furnace could have a selling price of ...
Defect inspection technologies to meet the challenges of advanced CMP process
Fast, accurate inspection for defects caused by CMP processes is essential to an effective yield management program. Dark-field system parameters such as illumination angle, polarization, and the effe ...
People Update
Gel-Pak, Sunnyvale, CA, a former division of Vichem Corp., has named Jeanne Beacham president. She was VP of sales and marketing. Chris Brodie has Jeanne Beacham been appointed VP of manufacturing. He ...
Semiconductor precursors market study
This volume titled Semiconductor Building Block Materials: Growing Markets for Material Precursors (GB-206) analyzes the worldwide materials and devices market. The study points out that the principal ...
Filter selection software
This CD-ROM software package provides information on filter selection. inPHorm software walks users through product selections, performs math calculations, compares costs, generates complete drawings, ...
Optical lithography simulation guide
This 175-page book titled Inside PROLITH: A Comprehensive Guide to Optical Lithography Simulation by Chris A. Mack provides a description of the physical models that are found in a group of lithograph ...
Materials constitution volume
This 8500-page introductory compilation of the annual "Red Book" series produced by Materials Science International Services and the Russian information service VINITI extracts data, phase diagrams, a ...
Failure analysis reference guide
This multimedia, stand-alone failure analysis (FA) reference system provides chipmakers with new training methods and knowledge preservation for problem solving during semiconductor design, production ...
IC training course
This 45-min video training course titled Making the Microchip: At the Limits II describes the IC manufacturing process. The program is a revision of At the Limits, a video used by universities, IC man ...
Semiconductor surface preparation book
This 545-page volume titled Science and Technology of Semiconductor Surface Preparation documents symposium proceedings from the 1997 MRS Spring Meeting in San Francisco, CA. Its focus is to bring res ...
Pure water handbook
This detailed handbook explores the overall problems of water purity, identifies common impurities, and discusses methods of water purification. A revised edition of the 1991 original, it includes inf ...
Single wafer processing of in situ-doped polycrystalline si and si1-xGex
This article demonstrates the industrial feasibility of single-wafer CVD for key advanced BiCMOS (=0.35 ?m) and CMOS (=0.18 ?m) processing steps. In situ As-doped amorphous silicon layers improve elec ...
Literature Update
This full-color brochure provides an overview of paste adhesives and adhesive films for circuit assembly. ABLEBOND paste adhesives are designed for a variety of micro-electronic applications, includi ...
Literature Update
SGS-THOMSON Microelectronics, Paris, France, have agreed to establish a joint design center company in Seoul. The center will be used to develop ICs for existing consumer electronics applications and ...
Backside thinning system
Chip UnZip, the system that thins backside silicon in flip chips and other face-down designs to permit emission imaging of defects, has been enhanced so that the speed with which the die is thinned ha ...
Vacuum gate valves
Throttlemaster vacuum gate valves position the gate full open, full closed, or anywhere between, to an accuracy of ?0.002 in. (0.05 mm). The 1/4 DIN control module provides front panel manual control ...
Compact process ion gauge
The IMR 260 process ion gauge, designed for vacuum deposition processes, combines hot cathode ionization and Pirani gauges in one housing, with an expand measuring range to 10-6 - 1000 mbar. The Piran ...
Wide range manometer
The ATMION system measures pressures from atmosphere to 10-9 mbar with a single gauge by automatic switching between Pirani and Bayard-Alpert principles. The gauge is inserted in a protective adaptor ...
Vacuum preloaded air bearings
Because these vacuum preloaded air bearings hold themselves down while gliding at a predetermined height above the guide surface, they allow even lightly loaded stages to operate with high stiffness ...
Vacuum pumping systems
On-Board TurboPlus vacuum pumping systems allow deposition processes to be performed at lower background pressures and save time in tool pumpdown to base pressure following atmospheric exposures. The ...
Equipment integration software
STATIONworks delivers off-the-shelf drivers, off-the-shelf applications, and the core technology required for rapid roll-out of configurable semiconductor manufacturing equipment automation solutions. ...
Etcher upgrade
The TadiVac2000 system/process monitor is designed to monitor and store all critical process parameters for the Tegal 900 series etcher. It will also "alarm" when endpoint slope varies beyond the pre ...
Surface modification and cleaning
This 18-in. aluminum chamber plasma cleaning system eliminates wet chemicals in cleaning processes, is CFC-free, and produces no harmful effluent. It can be used in surface modification to increase bo ...
Failure analysis/debug
Laser microchemical processing systems achieve high-speed (>100,000 ?m3/sec) etching of probe trenches through hundreds of ?m of backside, flip-chip silicon ICs, and rapid deposition of narrow (<1-30 ...
Sputtering system
The SSC-1000 sputtering system incorporates upper and lower base plates for sputter up or sputter down operation. It is a multistation, moving substrate system, configurable with up to four adjustable ...
Wet process station
Model 260 is a wet process station, available in lengths of four, six, or eight feet and fabricated from type 304 stainless steel (0.074 thk) with #4 finish. Features include filtered quartz etch tan ...
Reflow furnace
The Ultra Profile 4000 furnace is a 12-zone reflow soldering system that offers seven heat zones and three liquid cooled zones, plus load and unload zones for integration into assembly lines. Capable ...
Grazing reflection metrology
X-CALIBER is a grazing reflection metrology tool for the precise and rapid measurement of film or substrate density, linear thin film thickness, and surface and interfacial microroughness. The tool`s ...
Metrology tool for 300mm
The MetaPULSE 300 nondestructive, metal-film metrology system uses picosecond ultrasonic laser sonar technology to measure on product wafers. Capable of measuring film thickness in multilayer stacks, ...
Cluster tool systems`
The EV155 automated resist processing system provides spin coating, curing, and developing of photoresists for single wafers and substrates; the EV160 automated developing system provides automated re ...
SMIF wafer sorter
The MVT 7080 SMIF wafer sorter quickly and safely sorts, splits, merges, or randomizes 75- to 200-mm-wafer lots at rates up to 300 wafers/hour. The system features: a four-axis robotic handler with an ...
Closed ion source gas analyzers
The CIS series closed ion gas analyzers offer better than 1 ppm detection limit for all gases and direct sampling at mtorr pressure. A real-time Windows software package is provided for on-line proces ...
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