Deep-UV step-and-scan system
The PAS 5500/700B high-NA, DUV step-and-scan system, for 0.15-?m design rule applications, has stepping speed of 500 mm/sec and scanning speed of 250 mm/sec. It is equipped with Carl Zeiss` Starlith 7 ...
Semiautomatic dicing systems
Two additions to the 980plus precision dicing line improve productivity by enhancing yield and process capability. The 984plus is designed for hard materials such as TiC, ceramics, glass, and sapphire ...
Wafer substrate flatness inspection
The WYKO SFT4500 wafer substrate flatness inspection system is a noncontact instrument that improves process characterization of thin-film head wafer substrates by providing single- or double-sided me ...
3-D defect analysis and CD measurement
Designed and configured to meet the requirements of both the semiconductor and data storage industries, the Micrion C3D system is used for applications including process control (both production and R ...
Lithography data analysis
ProDATA, a software tool for analyzing experimental lithography data, imports, analyzes, and visualizes experimental data and provides optimum lithographic process information in a matter of seconds. ...
Multilayer sputter deposition
The Nimbus 300 multilayer sputter deposition system is designed for high-volume/low-cost production applications. The 1.3 ? 2.5-m cassette-to-cassette system features three progressive levels of vacuu ...
On-wafe RFIC text capability
With RFIC on-wafer test functionality, the HP 84000 RFIC test solution now features software that adds to the system: real-time wafer mapping, a binning summary, automated probe system control, and fi ...
All-optical wafer measurement system
Impulse 300 performs nondestructive multilayer film thickness and uniformity measurements on semiconductor wafers. The system uses lasers to provide noncontact ?-level repeatability on all metal films ...
Formation of ultra-shallow junctions by ion implantation and RTA
Forming sub-100-nm junctions for source/drain designs in <180-nm devices requires optimized low-energy ion implantation and rapid thermal annealing to place dopants accurately and activate them withou ...
SECS-GEM for Y2K testing in fabs
Potential "year 2000" problems have reached almost mythical proportions. Unfortunately, they have generated excessive studies and pontification. The solution, particularly for semiconductor wafer fabs ...
FIB technology keeps pace with process and packaging developments
Engineers depend on sophisticated equipment, such as focused ion beam systems, to help them analyze circuit performance. A growing number of chips are now assembled using flip chip. Flip-chip packagin ...
Strategic partnering principles
In today`s world of high technology, many links must be created between manufacturers to deliver leading-edge solutions to customers. In the semiconductor industry, with its complex manufacturing and ...
Can SEMI find some "leading indicators"?
There was a poignant pair of sentences in the statement issued by SEMI`s All Industry Forum, held on the eve of SEMICON Southwest to discuss topics for industry cooperation. The second paragraph in th ...
Worldwide highlights
September SEMI book-to-bill down again, to 0.57. Orders for semiconductor equipment from North American producers took another sharp downturn in September, dropping 16% from August levels to $476.4 mi ...
USA
Under a new agreement, Unitive Electronics will get some help from Karl SUSS in commercializing its wafer bumping and redistribution process developed at the Microelectronics Center of North Carolina. ...
Japan
Matsushita Electronics Corp. is postponing production at its Toyama Prefecture DRAM fab by a year and will delay other plans to build a fab dedicated to 0.18-?m processes in Japan, according to the Ni ...
Asia / Pacific
Taiwan Semiconductor Manufacturing Co. (TSMC), Hsinchu; Royal Philips Electronics, the Netherlands; and EDB Investments, Singapore, have formed a joint venture to build a wafer fabrication facility in ...
Europe
Steag Micro Tech GmbH, Pliez-hausen, Germany, and IMEC, Belgium, have extended their cooperation on cleaning technology including the installation of a Poseidon Single Tank Tool at IMEC. The tool will ...
BACUS attendees focus on mask costs
While the unknowns associated with future mask technology and costs linger, 248-nm DUV lithography strength was evident at the 1998 BACUS Symposium on Photomasks.
193-nm litho conference challenged by insertion
With likely insertion at the 130-nm technology node in 2003, details at the International Symposium on 193-nm Lithography showed that lithographers still face the challenges of simultaneously insertin ...
New SOI process
Campbell, CA, start-up Silicon Genesis Corporation (SiGen) has developed a new silicon-on-insulator (SOI) technology that purports to offer a less expensive way to get higher quality wafers. SiGen has ...
Philips acquires Active Impuls Systems
Philips Analytical, a division of Philips Electronics of the Netherlands, has acquired Active Impulse Systems, Natick, MA, to expand its line of wafer measuring instruments. Active Impulse, founded by ...
Bubble-free ozonated Di water for wafer cleaning
The presence of residual ozone gas bubbles during critical cleans, such as ozonated deionized (DI) water rinses following dilute HF cleans, can generate streaky particle patterns on the water surface. ...
"Gold-free" processing for RF
Adapting aluminum-based technology from its CMOS fabs, engineers at Motorola are now applying a proprietary new "hot-metal" process to RF MOS devices in production. It replaces conventional gold inter ...
I300I makes 0.12-um lines with 248-nm exposure
In cooperation with several equipment suppliers, lithography engineers at SEMATECH`s International 300-mm Initiative - I300I - have achieved 0.12-?m lines and 0.24-?m spaces on both aluminum and bare ...
Big surge coming forecasts TSMCs Morris Chang
As semiconductor slumps go, this one is relatively mild, and it will be followed by a big surge in business, predicts Morris Chang, chairman of foundry-leader Taiwan Semiconductor Manufacturing Co. (T ...
Upbeat Europe aims to upgrade its chip technology
Recent visits to a wide range of semiconductor fabs, research facilities, and process tool companies across Western Europe revealed an optimistic, forward-looking mood at most facilities, quite un ...
Indicators hint at an upturn in the equipment industry
Semiconductor equipment companies are in the grip of an industry downturn the likes of which have not been experienced in over a decade. Many companies are reporting quarterly losses and have announce ...
Global yield engineering for IC production
A comprehensive approach to yield engineering can identify hidden variables that have the greatest influence on global fab yield. Software macros were written to extract yield sensitivities more quick ...
People Updates
Sputtered Films Inc., Santa Barbara, CA, has promoted Andrew Clarke to CEO. He joined the company in 1989 as a physicist, was appointed director of product development in 1994, and most recently held ...
Integrated IT solutions group
A new Semiconductor and Electronics Group has been formed to provide information technology (IT) solutions for the semiconductor industry. The group`s focus is on manufacturing execution system (MES) ...
Wafer chuck reconditioning
Wafer chuck reconditioning services are now being offered by a manufacturer whose fixtures accommodate round or square wafer/vacuum chucks up to 48 in. Precision vacuum chucks are manufactured to extr ...
CD-ROM training programs
Texas Engineering Extension Service (TEEX) and SEMI have formed a partnership to market and distribute self-paced, multimedia courses on CD ROM for the semiconductor professional. Two, Semiconductor P ...
Thin film supplement: Reactive sputtering
This 88-page supplement to the Handbook of Thin Film Process Metrology covers reactive sputtering, and will be of interest to industrial and academic researchers, as well as owners of the main volume. ...
Submicron mircolithography
This 800-page text details both elementary and advanced aspects of submicron microlithography, providing a treatment of theoretical and operating practices, as well as current research in the field. T ...
Cleanroom manual
The 56-page How to Save Thousands of Dollars on Your New Cleanroom is the latest in a line of cleanroom-related books. Written in language that makes cleanroom design clear and simple, the manual targ ...
Microprocessor reports
Two reports from a semiconductor research firm provide details on new microprocessors. The first (Report No. # SCA 9808-587) describes IBM`s Power PC 750 microprocessor, which is constructed with six ...
A novel resist and post-etch residue removal process using ozonated chemistry
A novel, environmentally friendly process has successfully removed photoresist and organic post-etch residues from silicon surfaces. The moist ozone gas phase process described here greatly increases ...
Literature Update
This six-page brochure describes improvements in the Transpector 2 gas analysis system, a quadrupole-based smart sensor that contains sensor drive electronics and a microprocessor in a compact enclosu ...
Dual reactor vertical furnace
Designed for 300-mm wafer processing, the A412 dual reactor vertical furnace is a combination of an LPCVD silicon nitride and TEOS tube and an LPCVD in situ doped polysilicon tube. It is configured wi ...
Low-profile pressure transducer
Model TLD is a high-performance, low-profile pressure transducer/local display that meets the stringent standards of semiconductor pressure measuring applicatiions. Manufactured in a Class 10 cleanroo ...
Metering valve
The Series 100 Accu-Flo metering valve is designed for precision gas admission in various vacuum processes and the control of system pressures as low as 1 ?10-11 torr. It is available in chrome-plated ...
Wet enviroment robot
The Gencobot Wet Environment Robot (GB7-W), the latest addition to the GPR series robots, has a protective enclosure to prevent water penetration, addressing problems associated with CMP or wet proces ...
Intelligent robotic control
Autocalibration reduces setup and replacement time for wafer-handling robots by giving them the ability to teach themselves. The robot learns its environment using proprietary methods, keeping transpo ...
PTFE chemical valves
These large-diameter (14 through 24 in.), high-performance PTFE butterfly valves have been added to the Series 22/23 line in both wafer and lug bodies, and offer the same chemical resistance of PTFE s ...
Piezoelectric valve
The MV-112 is a precision gas flow valve that uses a piezoelectric bender element as a seal actuator. The bender element responds in milliseconds with precise movements directly proportional to a 0-10 ...
High-voltage power supply
With an insulated gate bipolar transistor design for high reliability, the DPS-30 high-voltage power supply features all solid-state switching, water cooling, and robust construction, and is air-insul ...
Quick-disconnect couplings
ChemQuik CQH quick-disconnect couplings have a completely clear flow path and are designed to make possible instant disconnection during fluid transfer, from aggressive chemicals to ultrapure water. T ...
Ultrapure flared fittings
Chemfluor ultrapure flared fittings offer the highest pull-out strength, easy installation, and no cross-threading, and they can be used with a wide range of temperatures. The nuts are available in hi ...
Photoresist stripper
AZ EXP Kwik Strip is an amine-free photoresist stripper that is compatible with substrates of gallium arsenide, copper, nickel-iron, titanium-tungsten, and aluminum. It has a wide temperature process ...
Ultrapure nitric acid
Offered as part of the Class 1 semiconductor chemical line, this new grade of ultrahigh-purity nitric acid meets sub-ppb specifications. It will be used in this company`s MAE mixed oxide etchants and ...
Post-CMP cleaner
Evergreen Model 204 is a double-sided scrubbing system for wafers up to 200-mm. It has two brush scrub stations, each with the PVA dual-brush system, loaded and unloaded by a high-speed, multiprocessi ...
DUV microscope
The LU2000-DUV inspection system allows fab operators to observe and analyze lines and spaces with widths down to 0.1 ?m by using visible light to inspect ultra-minute patterns and then changing (at t ...
Integrated film thickness measurements
The NanoSpec 9000 is an ultracompact thin-film measurement system that uses noncontact visible reflectometry and can be integrated into CMP systems to determine removal rates and uniformity; into depo ...
Wafer dimensional measurement
The S9600A2 is a fully automatic metrology station that measures the dimension and shape of silicon and nonsilicon wafers, materials, and substrates with sub-micron accuracy. Using noncontact, auto-po ...
Defect inspection and review
DART Version 2.5 software for Windows NT 4.0 is used with this company`s inspection tools for full automation of wafer inspection, allowing the user to locate, evaluate and classify defects at any sta ...
Remote monitoring/operation of ion implanters
The Dedicated Network Option allows the connection of any combination of this company`s high-energy, high-current, or medium-current implanters, by using a dedicated LAN. Key benefits of the system ar ...
Non-cure chip adhesives
ABLELOC 5850 nonconductive tape adhesive is designed for high-reliability semiconductor applications. A thin layer of high-purity thermoplastic adhesives is coated onto both sides of a polyimide carri ...
Remote control for dry pumps
This remote control package for VRC dry pumps gives the operator complete control of all parameters of pumps located up to 300 feet away. From the 14 ? 8.75-in. (356 ? 222-mm) panel, the operator can ...
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