Wafer cleaners ad processors
Designed for such applications as scrubbing, inline cleaning, solvent processing and metal lift-off, acid etching, and developing, the Evergreen Series II spindle tool cleaners and processors - for wa ...
Wide-field, 193-nm step-and-scan
The PAS 5500/900 wide-field, 193-nm step-and-scan system has been designed for next-generation processes, with linewidths from 150 nm to 130 nm. It meets the SIA Technology Roadmap`s timeline for qual ...
200-nm wafer CV-IV probing
With the move to 300-mm wafers delayed, and the trend toward shrinking geometries (0.18 and 0.13 ?m) accelerating, the need for high-accuracy CV-IV probing on 200-mm wafers is increasing. The 12861 pr ...
Machine vision system
The Visionscape machine vision system is a hardware and software solution with its own on-board processor. It supports up to four analog cameras, advanced digital cameras, on-board SVGA display, digit ...
Point-of-use abatement
This new integrated thermal processing unit (TPU) provides point-of-use abatement for CVD and oxide etch applications, handling both deposition and etch gases. The newly designed inlet head offers goo ...
High-power excimer laser
The NovaLine F500 series of high-power F2 excimer lasers allows system and process development of microlithography at feature sizes =0.1 ?m. The 157-nm laser delivers 10 W of stabilized output power a ...
Hydrogen atom source
Model HA10 Hydrogen Atom Source produces a high-purity, tunable flux of H atoms >1015 neutrals cm-2 s-1 with an average energy of 1 eV. The flux is produced by electron stimulated desorption of H atom ...
Subsurface defect detection system
The PBS-1000 Fast Mapper subsurface measurement system maps the level and distribution of subsurface defects in Si and GaAs materials. The defects of interest are typically introduced into the materia ...
Heres the case for back-end factory automation
Careful analysis of semiconductor manufacturing`s "back end"- test, assembly, and packaging - shows that investment in factory automation is significantly out of sync with investment in automation for ...
Electroplating bath controls for copper interconnects
Electroplating bath composition plays a significant role in deposited copper film properties. Methods were developed to replenish plating bath additives depleted while depositing copper on semiconduct ...
1999 looks like a very busy year
While semiconductor fabrication has undergone some dramatic changes throughout its history, in recent times the industry has settled on digital CMOS circuits on silicon. By far, this represents the bu ...
World highlights
North American semiconductor equipment makers logged orders of just $631.5 million in August, half the level of six months earlier and almost 15% below July (see table). Companies shipped $1.06 billi ...
USA
Motorola`s Semiconductor Products Sector has decided to indefinitely postpone work at its Richmond, VA, fab, less than a year after rebooting the $3 billion project there. A spokesman said constructio ...
Japan
Japan-based Kokusai has merged its Kokusai BTI Corp. and Kokusai Semiconductor Equipment Corp. units into a single organization known as Kokusai Semiconductor Equipment Corp. (KSEC), headquartered in ...
Asia / Pacific
Taiwan semiconductor consortium. Taiwan`s government-sponsored Electronics Research Service Organization will be involved in the formation of a SEMATECH-like research consortium on the island. Taiwan ...
Europe
Siemens AG is making a rapid exit from the 16-Mbit DRAM market with plans to close its 15-month old DRAM fab in North Tyneside, England. The chipmaker`s semiconductor group recently reported losses to ...
Wafer-level burn-in will cut times and cost
Motorola Semiconductor Products Sector and Tokyo Electron (TEL), with the help of W.L. Gore and Associates, are on track to be the first in the semiconductor industry to qualify wafer-level burn-in pr ...
In situ process could cause scientific revolution
A mobile instrument being rolled around Bell Labs could change in situ particle detection during wafer processing from an art to a science and could have a major impact on semiconductor manufacturing. ...
Japans ASET researches EUV litho
In a move that may suggest a broadening of enthusiasm for extreme UV lithography technology, Japan`s government-funded Advanced Semiconductor Equipment Technology (ASET) organization has begun a progr ...
Hiroshima SSDM meeting overview
The International Conference on Solid State Devices and Materials (SSDM), held in Hiroshima, Japan, recently, featured a rump session on future silicon substrates, which included a panel discussion of ...
The Challenges and rewards of local manufacturing in Japan
Local manufacturing of US products in Japan is not a new concept, but such ventures are unusual in the semiconductor equipment industry. A successful partnership must be able to offer high-performance ...
Materials issues in 2000/2005
The demand for semiconductor devices is continuing to increase at such a rate that the number of devices produced worldwide in the year 2005 is expected to be 10? 1996 levels. The amount of materials ...
Hitachi reorganizes
With pricing pressures in the DRAM sector persisting, Hitachi is shifting its emphasis. The company is undertaking a major reorganization of its chipmaking operations, breaking what is now a single di ...
Asias equipment supply: Buying and selling used
In certain situations, adding used semiconductor manufacturing equipment to your production line is a good choice; increasingly, this is a viable choice for the growing semiconductor industry in Asia. ...
MEMS program at Sinapores Institute of Microelectronics
The Institute of Microelectronics (IME), Singapore, is a multidisciplinary research institute specializing in core areas of microelectronics. The mission of this applied R&D organization is to help nu ...
Europe: A worldwide player
The European semiconductor industry was riding on the crest of a wave during the first half of 1998, but with the worldwide semiconductor downturn, the European industry has fallen as well. The most v ...
Dual damascene aluminum for 1-Gbit DRAMS
Roy Iggulden,* Larry Clevenger,* Greg Costrini,* David Dobuzinsky,* Ronald Filippi,* Jeff Gambino,* Chenting Lin,** Florian Schnabel,** Stefan Weber,** IBM*/Siemens** DRAM Development Alliance, Hopewe ...
High-accuracy warp and stress measurement
As it applies a super-high accuracy hyper air slide, this system has a very high level of repeatability. It rapidly calculates the stress distribution of an x-ray mask from the difference between wafe ...
Automatic BG tape laminator and remover
The Adwill RAD-3500F/12 fully automatic BG tape laminator handles 150-, 200- and 300-mm wafers. The system features a tape tension control system that allows the most suitable tape lamination to be u ...
High-speed bump bonder
This high-speed bump bonder, with die tray auto loader, is designed for mass production of chip-scale packages and ball grid arrays. Bumps are formed directly onto the pad of die supplied from the tra ...
Mapping sensor
The F3M-S mapping sensor allows the mapping of cassettes that have both silicon and glass wafers. The sensor automatically detects inexpensive opaque dummy wafers, with a transparency rate of 92% max, ...
Cryogenic probing stations
The Model BCT series cryogenic probing system operates without liquid helium or nitrogen and can measure semiconductor parameters and microwave characteristics in the 4K to 150?C (max) wide range. The ...
Die bonder for small lots
Developed as a robot for use in the production of small lots of many types of semiconductors, this system comprises a Scarates dual-arm scalar robot; a chip vacuum chuck head (including centering mech ...
Optical lithography below 100nm
Optical lithography has been the primary patterning technology for IC production for 30 years. Momentum and astounding improvements in resists and optics have forestalled the introduction of more comp ...
Companies outsource to concentrate on core business
As the semiconductor industry gets more complicated, chipmakers are finding it worthwhile to outsource some fab operations and lease some process equipment. While outsourcing is not a new idea, the cu ...
Automation, integration and data management for the back end
A comprehensive solution to the demanding automation and integration needs of test, assembly, and packaging - semiconductor manufacturing`s back end - is essential to improving fab productivity. From ...
Photoresist adhesion promoter packet
The nonaminic advanced priming system (NAAPS), a new, patented technology for use in priming substrates and promoting uniform photoresist film formation, is described in this packet. Operating as a dr ...
DUV brochure
Deep ultraviolet (DUV) measurement and calibration products are featured in this brochure, including DUV exposure meters, and energy and power meters. Products like the EM 500e are lightweight and por ...
On-line sealing handbook
The Right Seal guide to sealing in semiconductor manufacturing processes can now be accessed on the internet. Introduced in hard copy form in 1997, the handbook provides detailed technical information ...
Microscopy Magazine
Innovation Lambda: Magazine of Microscopic Imaging and Analysis is a new publication available to microscope users. The magazine discusses innovative products, introduces readers to new image analysis ...
E-beam moire publication
Highlighted in this brochure is the relatively new electron-beam (e-beam) moir? technique that measures submicrometer strains on a local scale in electronic packaging. The publication describes the ba ...
ICP mass spectrometry
The VG Axiom, an inductively coupled plasma (ICP) mass spectrometry instrument for high-resolution and multicollector functions, is highlighted in this four-color brochure. The tool interfaces a doubl ...
Mass flow meter data sheet
Technical literature on the Model 640-S Smart Insertion mass flow meter is provided in this new data sheet. The microprocessor-based transmitter integrates the functions of flow measurement, flow-rang ...
Gas analysis
This six-page brochure describes improvements in the Transpector 2 gas analysis system, a quadrupole-based smart sensor that contains sensor drive electronics and a microprocessor in a compact enclos ...
Glass components catalog
This newly updated catalog contains a range of borosilicate and quartz glass flanges and fittings, as well as corresponding chain clamps and seals for numerous applications, including R&D, ultrapure w ...
O-ring and seal reference guide
The updated O-ring and Seal Material Reference Guide (ORD5703A) provides the O-ring specifier and designer with a 44-page source for basic size, gland design, and material information on O-rings. New ...
Temperature products catalog
Information on a line of temperature, air velocity, and humidity-related equipment is offered in this 40-page catalog. Among the items featured are handheld thermocouple thermometers (including single ...
Heated vacuum value brochure
This 16-page, color brochure details a line of vacuum valves designed to be used in semiconductor processes like low-pressure CVD, where production by-products can condense and build up. Because the p ...
Transport module controller data sheet
This data sheet describes the Techware 5 Express, a standard controller for Marathon Express cluster tool automation platform configurations and components, including the MagnaTran 7 robot, the VCE 6 ...
In situ photoresist sensor
This in situ sensor detects unwanted photoresist in the wafer de-gas stations of PVD systems. Fully integrated into PVD cluster tools, the detector interrupts the processing of any wafer that enters a ...
Portable cleanroom
The 200-mm Portable Clean Room is a hand-carried microenvironment, for worldwide wafer transport. It has two sections: a base housing and a wafer chamber. The sealed chamber is designed to maintain a ...
Wet bench construction material
Corzan 4910 CPVC white sheet material is designed to blend strength, weldability, and chemical resistance. It is suitable for wet bench construction, meeting FM4910 Corporation Class requirements, and ...
Automatic visual wafer inspection
The WAV-1000 system, for the automatic visual inspection of wafers, accommodates post-probe or pre-probe inspection. It is optimized to detect a full range of defects, such as contaminants, voids, scr ...
Die sorting system
Model 2010 is a die demounter that can easily remove a fully sawn wafer from a film frame in <30 sec. Die as small as 0.01 in.2 can be peeled quickly and easily without damage. Wafers with 1-6 in. dia ...
Teflon wafewr carriers
EPI Teflon wafer carriers are molded and precision-machined from a single piece of PTFE or PTFM in sizes that handle wafers from 3 to 12 in. Free of microvoids and microporosity, the seamless carriers ...
Wafer-handling system
The WHU300 provides chipmakers with a complete wafer movement solution for their process tools. It is designed to receive a SEMI-standard FOUP, orient it, open it, and transfer wafers to the process s ...
Variable-speed sectioning saw
The TechCut variable-speed sectioning saw has features that include: dual cutting modes - constant sample advancement or pre-set sample load; variable blade speeds of 100-4000 rpm; automatic sample ad ...
UHV rotary stage
The UHVL-RS rotary stage, for ultrahigh vacuum, is designed for the most precise alignment applications, such as aligning defraction gratings, rotating samples in thin-film processes, and wafer proces ...
High-vacuum diffusers
The Key High DF series diffusers are designed to introduce large quantities of gas quickly into a vacuum chamber or loadlock during the venting of a process. They break up the incoming gas stream even ...
Optical emission monitor
Designed for plasma diagnostics and endpoint detection, the INTELLUX 400 is a transducer-type, microprocessor-based, multichannel optical monitor with RS-485 and DeviceNet interfaces. It can accommoda ...
Cluster tool
This multiwafer, batch-processing cluster tool is designed for low-pressure CVD and ultrahigh vacuum CVD films. It simultaneously processes a boatload of wafers in each of the three process chambers i ...
Residue-removal chemistries
EKC525 Cu removes post-etch residue from copper substrates where low-k dielectrics are used, providing an ultraclean surface while eliminating any harmful effects on copper or low-k dielectrics. EKC50 ...
Flow sensors for corrsive liquids
Series 106 Flo-Sensors measure very low flow rates from 15 ml/min to 10 l/min with ?1% accuracy. They have onlyTeflon and sapphire as wetted surfaces and can replace conventional glass tube and ball ...
CMP robot
The RR721 water-resistant robot series, for 300-mm CMP applications, features dual-arm architecture, a splash-proof upper body, and a 300-mm Z-axis stroke for 25-slot 300-mm FOUP access. The upper arm ...
Quick-disconnect couplings
ChemQuik CQH quick-disconnect couplings have a completely clear flow path and are designed to make possible instant disconnection during fluid transfer, from aggressive chemicals to ultrapure water. T ...
Low-profile pressure transducer
Model TLD is a high-performance, low-profile pressure transducer/local display that meets the stringent standards of semiconductor pressure measuring applicatiions. Manufactured in a Class 10 cleanroo ...
PTFE chemical valves
These large-diameter (14 through 24 in.), high-performance PTFE butterfly valves have been added to the Series 22/23 line, in both wafer and lug bodies, and offer the same chemical resistance of PTFE ...
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