Reticle inspection system
The Orbot RT-8000ES reticle inspection system is designed to meet the needs of the 0.25-?m, 256-Mbit device generation. Defects can be detected on the most advanced reticles, including those using opt ...
High-yield flip chip bonder
The FC250 production flip chip bonder offers precise bonding capabilities, with good alignment and leveling accuracy better than 2 ?m. Throughput is >200 units/hour. Designed to level, align, and bond ...
Fpd surface profiler
DEKTAK OSP-1100 is a stylus-based profiler with the capacity to handle flat panel displays measuring up to 1100 ? 1100 mm. The Overhead Scanning Profiler design gives highly repeatable measurements fo ...
Process Furnaces
Series 6000 furnaces are designed for such processes as diffusion, oxidation, annealing, and LPCVD, on wafers up to 300 mm. Features include operational temperatures to 1300?C; closed tube processing ...
Managing customer loyalty
Keeping customers is easier and more profitable than finding new ones. Not only a well-known adage, it is the primary driving force behind customer satisfaction programs. However, while companies try ...
Chip industry workers deserve world-class fire safety
Any time a fire or other emergency erupts in a wafer fab, it`s potentially deadly. Fabs are, by design, tightly contained environments, usually without direct access to the outdoors, and dependent on ...
Commentary: The EUV-LLC and the systems integration question
After a half-year or more of searching for partners to develop extreme UV lithography, Intel Corp. has signed up Motorola and Advanced Micro Devices to take part in the private EUV Limited Liability C ...
Sia Update
Advances in semiconductor science and technology have created a modern day digital revolution that propels world economies and changes the way that we communicate and process information. At the ...
Sia update
Of all the Roadmap thrust areas, lithography may be the most directly affected by the accelerated introduction of 180-nm feature sizes (see table on page 74). According to committee cochair Karen Brow ...
Sia Update
The importance of modeling and simulation (M&S) in the semiconductor industry is growing, as demonstrated by its inclusion as a working group in the 1997 NTRS. In 1994, TCAD needs were documented in a ...
Sia update
Environmental, safety, and health (ESH) technology improvements are necessary to ensure that the semiconductor industry protects its most valuable resource, people, as well as the environment itself. ...
CMP to see healthy annual growth
CMP to see healthy annual growth. Global sales of slurry abrasives used in CMP are projected to increase at a rate of 25-30% a year through 2002, with annual growth extending five to 10 years beyond t ...
USA
Intel has agreed to purchase a Digital Equipment Corp. wafer fab for $700 million, delayed startup of its Fab 16 in Fort Worth, TX, and decided to switch the output of its forthcoming Fab 18 in Israel ...
Japan
The Semiconductor Equipment Association of Japan reported that Japanese equipment makers logged orders of 133 billion yen ($1.1 billion) in August, some 137% better than year-ago levels and the sevent ...
Asia/pacific
Taiwan chip exports. Officials from Taiwan`s Ministry of Economic Affairs said recently that Taiwan chipmakers will export some $28 billion worth of chips in 2005, but at the same time the region will ...
Europe
Air Liquide, Paris, France, is building an 8000-m3/hour plant at its Rousset facility. The company will supply high-purity nitrogen to SGS-THOMSON Microelectronics and Atmel`s plants in Rousset. The p ...
Sematech litho meeting: Good talk, no selections
An elite, worldwide group of researchers from semiconductor and equipment companies convened under SEMATECH auspices in Colorado Springs, CO, from Nov. 4-6 to discuss options for post-optical lithogra ...
Acoustic Imaging finds "halo" defect flip chips
Acoustic imaging has identified a flip chip defect in which underfill material flows around but does not come in contact with solder bumps (Fig. 1). The defect was found by researchers at Sonoscan`s a ...
Samsung Revs 64-mbit production in austin
Silicon has begun to flow through the new Samsung Austin Semiconductor (SAS) DRAM fab, for a 0.3-?m second generation 64-Mbit DRAM design - a market-driven step forward from the fourth-generation 16-M ...
Intel: 300-mm fabs will not arive for 0.18-um gemeration of devices
Microprocessor giant Intel is taking a less aggressive path toward adoption of 300-mm wafers than earlier planned, with the larger substrates not coming into play until after the 0.18-?m generation.
Sematech achieves low-K plus coppers
SEMATECH`s interconnect program has integrated spin-on low-k dielectric materials into its copper metal process some two months ahead of schedule, and an exploration of CVD low-k materials is set to b ...
Efficient new vuv light source
The search for short wavelength radiation sources for lithography has recently concentrated on pulsed lasers and laser-produced plasmas. Now, researchers at Rutgers University and Munich Technical Uni ...
Mitsubishi, IBM Move on X-ray plans, Medea to study IPL
Work at Mitsubishi Electric Corp. and IBM Corp. indicates continued development of an infrastructure for x-ray lithography, with Mitsubishi emerging as a likely test bed for production use. Meanwhile, ...
IBM plans 300-mm fab at east fishkill site
IBM will build a new developmental 300-mm wafer fab in East Fishkill, NY, and plans to begin producing DRAMs with 0.18-?m design rules by the end of 1999. The computer giant also plans to upgrade its ...
national technology roadmap for flat panel displays
Following decades of research, the flat panel display (FPD) industry has expanded rapidly in the past decade, primarily through the development of manufacturing techniques for liquid crystal displays ...
Fire Destroys Equipment at UICC fab in Hsinchu, taiwan; Production help up
United Microelectronics Corp. (UMC), Hsinchu, Taiwan, said production at its UICC joint venture has been shifted to its other sites after a fire destroyed the fab`s chipmaking equipment and suspended ...
Winbond rebuilds Fab 3
One year after a fire ripped through Winbond Electronics Corp.`s Fab III, the company said it has started to rebuild the Hsinchu, Taiwan, facility, and expects operations to begin by 1999.
Komatsu begins pilot 300-mm wafer production
Under two separate projects, Komatsu Electronic Metals Co., Hiratsuka, Japan, is planning to expand its 200-mm epitaxial wafer line, and its 300-mm wafer pilot production line.
European Unions Media Program
The European Union (EU) recently released details of a research program to focus European chipmaking skills in areas where EU companies are already competitive with Japan and the US. The Microelectron ...
Siemens British Fab opens
Siemens Microelectronics has opened its 16-Mbit DRAM facility in N.E. England, going from ground-breaking to production-ready in 17 months, and to full qualification in 21 months - four months ahead o ...
Newport Water-Fab Opens Facility
Newport Wafer-Fab (NWL), a subsidiary of Hong Kong-based QPL International Holdings Ltd., will open a 20,000-m2 facility in Newport (Duffryn), Wales, UK. The 230 million-pound ($360 million) project w ...
Impact of low temperature polysilicon on the AMLCD Market
Producing higher-performance displays at lower cost is a constant challenge for LCD manufacturers. In the 1980s, market demand forced a transition from passive twisted nematic displays to passive supe ...
Icreasing The value of semiconductor plant assests with MES
The value of a semiconductor manufacturing plant asset is directly related to its contribution to process repeatability and efficiency. A relatively small investment in manufacturing execution system ...
The Impact of the 300-mm transition on silicon wafer suppliers
In the 300-mm transition, silicon wafer suppliers face challenges similar to those faced by their customers, the device makers. They must develop high-yielding, simplified processes that produce a sup ...
Flat panel impact on CRT monitor markets
Many non-CRT flat panel technologies came about as a result of concepts and fabrication techniques that were developed for the semiconductor industry. Prime examples are high density photolithography ...
People
J.C. Park has been appointed chairman of Genus Korea Co. Ltd., Korean subsidiary of Genus Inc., Sunnyvale, CA. He was president and chairman of Aju Exim. In addtion, two other team members from Aju Ex ...
European exposure
Thank you for the excellent article, "ESPRIT`s Semiconductor Equipment Assessment Initiative," (October, p. 90). It is often difficult for European equipment companies to get exposure to the global ma ...
Article advice
I have three suggestions about topics for future articles in Solid State Technology: cleaning techniques for x-ray mask manufacturing process; cleaning techniques for deep narrow trench; and dry front ...
Asia clarifications
In reference to "China`s bid to join the submicron era," (October, p. 78), Tony Liu has not been VP of Hua Hong Microelectronics since June 1997. He left Hua Hong after China announced a joint venture ...
Thru-transmission scanning
This high-frequency thru-transmission scanning kit provides high-speed inspection that reveals delaminations at all interfaces. It uses a small beam spot to generate sharp, high-resolution images. The ...
Taping System
The TMBU-3D Tube automatic tape and reel system places into tape semiconductor components that are delivered in tubes, such as SOIC, TSSOP, SOJ, and PLCC. It can tape at a rate of 5000 parts/hour whil ...
Gas diffuser
The Chambergard FV-50K diffuser provides gentle laminar flow for wafers during venting of loadlock, cooling, and transfer chambers while protecting wafers from particles inside and outside the chambe ...
Hazardous gas monitoring
SmartMaxII is a digital control monitor that can handle readings from up to four types of sensors. A unit includes sensors for combustible gas, oxygen, and such toxic gases as hydrogen sulfide, and co ...
Pressure transducers
The Micro-Baratron 870 and 872 pressure transducers are designed specifically for use in process gas delivery systems. All wetted surfaces are constructed from chromium- and nickel-rich Inconel and In ...
Nitrogen generators
The 4000 series of cabinet-enclosed nitrogen generators can deliver gaseous nitrogen - on site - at purities of 95-99.5%, producing an uninterrupted supply from a compressed air source using air separ ...
Zoom beam expander
This 2? - 10? zoom beam expander for CO2 lasers is used for laser marking and drilling applications. The diffraction limited design allows active spot size variation and can easily be motor driven. St ...
Pulse preamplifier-discriminator
F-100T Version 7 is a fast pulse amplifier-discriminator that processes pulses from a photomultiplier tube or electron multiplier and replaces a preamplifier, a linear amplifier, and a lower level dis ...
Semiconductor components
EPI Teflon semiconductor components (for use in such equipment as valve plugs, aspirator nozzles, wafer carriers, and tanks) are molded and machined from PTFE and PTFM to customer specifications in si ...
Integrated Z and Theta stage
Incorporating servo feedback technology, this high-performance Z-Theta stage is completely noncontact via an air bearing system that virtually eliminates all wearing surfaces. Position performance doe ...
High-precision x-y stages
Suitable for such applications as wafer inspection, the AA12 and AA15 x-y stages are based on low mass and high stiffness by incorporating the MRC 15 series monorail guideways. The tables are manufact ...
Water/nitrogen guns
These PFA Teflon spray guns are suitable for either deionized water or nitrogen control in semiconductor production or laboratory applications. Benefits include: all wetted, high-purity components mad ...
Double brush scrubbing system
Used in the Evergreen series of wafer cleaners/processors (which support processes including post-CMP oxide and tungsten cleaning), this double brush system simultaneously scrubs both top and bottom o ...
Wafer cleaning system
Model UH 117 wafer cleaning system removes debris from sawing operations. It can clean wafers of diameters up to 150-mm, mounted on film frames. Fully programmable automatic microprocessor control and ...
Stepper with machine vision system
Model 1500MVS is a compact sub-?m stepper with machine vision system (MVS) alignment. As a pattern recognition alignment system, MVS eliminates the need for larger scribe lines between each die to hol ...
UHV gate valve
Series 10 all-stainless-steel UHV gate valves incorporate smooth, camless sealing to distribute pressure evenly around the plate for minimal closing shock and wear. Incorporating a vulcanized seal rat ...
TOC analysis sytem
The A-1000XP TOC analyzer is designed for demanding TOC measurements in ultrapure water. The instrument`s stability and repeatability allow changes as small as 0.001 ppb TOC to be reported. Typical d ...
Corrosive liquid sampling system
The CLS-900 system, which samples contaminants in hot process chemicals in wet benches, is a modular system consisting of Windows-based software and three hardware subsystems (a base control unit and ...
HEPA filter
HEPAir is a single unit that fits into a standard 2 ? 4-ft T-bar ceiling and combines all the features of the fan-powered filter module with a completely self-contained air conditioner. This delivers ...
Particle measurement
Models WM-1500/1700 automatically detect particles on a wafer`s surface at 0.1-?m sensitivity, using scattered laser light detection technology. The systems provide a dynamic measurement range of 0.1- ...
Secondary ion mass spectrometry
The shrinking of the lateral dimensions of semiconductor devices to =0.25 ?m is accompanied by an even greater reduction of the junction depth, to <100 nm. The energy of the SIMS 4500`s analyzing beam ...
Backside thinning system
Chip UnZip, the system that thins backside silicon in flip chips and other face-down designs to permit emission imaging of defects, has been enhanced so that the speed with which the die is thinned ha ...
Ultrapure water systems
Clear Series ultrapure water systems (for IC manufacturing) use a single multifunctional cartridge containing an active carbon stage, a high-performance mixed-bed ion exchanger, and a scavenger stage ...
Bulk Silane-- a potential hazard or a potential hazard reducer
The semiconductor industry has long sought to reduce the hazards involved in silane handling by using very low concentrations in inert carriers or by eliminating silane from processes. A new approach, ...
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