Enhanced litho scanner

The Twinscan NXTS features a new planar wafer stage design that incorporates new materials to reduce weight by 66% vs. previous generation Twinscan systems; a new positioning measurement system improves overlay improvement by 50%. Vertical interferometers measure placement of the stage relative to an overhead grid plate, resulting in a much shorter light path and reducing the impact of air turbulence. Throughput is improved by ˜30% thanks largely to new autonomous, magnetically levitated stage platforms that allow immersion fluid to move from one to the other, reducing resistance to acceleration/deceleration and lowering swap times. ASML, Veldhoven, The Netherlands; ph +31/40.268.3000, www.asml.com.

See Katherine Derbyshire’s analysis of the Twinscan NXT at www.solid-state.com.

Single-wafer cleaning system

The Orion single-wafer cleaning system has a unique closed-chamber design that the company says addresses several cleaning-related issues in 32nm and 22nm manufacturing, notably reduction of material loss during photoresist stripping after ultrashallow implants, and the elimination of material loss and galvanic corrosion in high-_k metal gates and copper interconnects with metal-containing capping layers. The catalyst together with a process temperature >20-50% higher than standard wet bench processes temperature enable a reaction rate 4000x faster than the reaction rate of standard all-wet photoresist stripping processes. A spray bar gives greater wafer coverage than a single point nozzle with more efficient chemical and water usage. The tool’s design accommodates multiple chamber types and permits the addition of modules. FSI International, Chaska, MN; ph 952/448.5440, www.fsi-intl.com.

See Debra Vogler’s analysis of the FSI Orion at www.solid-state.com.