eNewsletter
Magazines
RSS | XMLRecent Features
- 2009 Economic forecast Look for rebound by 2010 01/01/2009
- Status and trends in 300mm manufacturing 01/01/2009
- The year ahead: a time for innovation 01/01/2009
- Featured Products 01/01/2009
- Product News 01/01/2009
Recent Products
- Centura Enabler E5 01/01/2009
- Enviro Xceed400 01/01/2009
- NT series of aligners and measurement systems 01/01/2009
- V6000 01/01/2009
- 655D CVD 01/01/2009
Report: Merger imminent for China's Hua Hong NEC, Grace Semi
Date: December, 2008
Dec. 1, 2008 - Chinese foundries Hua Hong NEC (HHNEC) and Grace Semiconductor Manufacturing Corp. are finalizing merger plans in the next few weeks, according to a report by Digitimes citing a local chip industry group.
The two firms started merger talks a couple of months ago, and expect to finalize terms by the Lunar New Year, the site claims, citing a report by the Shanghai Integrated Circuit Industry Association. The government is said to support such a deal. HHNEC, which has been involved in several government projects, currently owns two 200mm fabs with 60,000 wafers/month capacity; Grace currently has 35,000 wafers/month capacity at its Shanghai operation.
ADVERTISEMENT
Middle
