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- integrated ODP metrology with floating n&k’s 06/01/2009
- Engineered to the task: why camera-phone cameras are different 06/01/2009
- Thin films for 3D: ALD for non-planar topographies 06/01/2009
- Combined reflectometry-ellipsometry technique to measure graphite down to monolayer thickness 06/01/2009
- Memory sector ready to rebound? Not quite 06/01/2009
Recent Products
- Centura Enabler E5 01/01/2009
- Enviro Xceed400 01/01/2009
- NT series of aligners and measurement systems 01/01/2009
- V6000 01/01/2009
- 655D CVD 01/01/2009
Report: Merger imminent for China's Hua Hong NEC, Grace Semi
Date: December, 2008
Dec. 1, 2008 - Chinese foundries Hua Hong NEC (HHNEC) and Grace Semiconductor Manufacturing Corp. are finalizing merger plans in the next few weeks, according to a report by Digitimes citing a local chip industry group.
The two firms started merger talks a couple of months ago, and expect to finalize terms by the Lunar New Year, the site claims, citing a report by the Shanghai Integrated Circuit Industry Association. The government is said to support such a deal. HHNEC, which has been involved in several government projects, currently owns two 200mm fabs with 60,000 wafers/month capacity; Grace currently has 35,000 wafers/month capacity at its Shanghai operation.
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