Recent Features
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- Engineered to the task: why camera-phone cameras are different 06/01/2009
- Thin films for 3D: ALD for non-planar topographies 06/01/2009
- Combined reflectometry-ellipsometry technique to measure graphite down to monolayer thickness 06/01/2009
- Memory sector ready to rebound? Not quite 06/01/2009
Recent Products
- Centura Enabler E5 01/01/2009
- Enviro Xceed400 01/01/2009
- NT series of aligners and measurement systems 01/01/2009
- V6000 01/01/2009
- 655D CVD 01/01/2009
Edwards, TEL to make abatement tech for etch
Date: November, 2008
Nov. 26, 2008 - Edwards and Tokyo Electron Ltd. are planning to jointly develop a perfluorocarbon (PFC) gas abatement system, with availability slated for mid-2009.
The PA-01E, incorporating a plasma abatement device developed with Japan's Adtec Plasma Technology Co., will help reduce PFC pollution resulting from dielectric film etching processes in semiconductor manufacturing; it also will abate carbon monoxide, eliminating the need for additional abatement hardware. The tool also will feature reduced requirements for energy, consumables, and maintenance.
"We look forward to working with TEL's engineering staff to provide an effective, low cost-of-ownership gas abatement system specifically designed to reduce the dangers of PFC pollution as a result of the semiconductor etch process," said Nigel Hunton, Edwards' CEO. in a statement.


