Recent Features
- 2009 Economic forecast Look for rebound by 2010 01/01/2009
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Recent Products
- Centura Enabler E5 01/01/2009
- Enviro Xceed400 01/01/2009
- NT series of aligners and measurement systems 01/01/2009
- V6000 01/01/2009
- 655D CVD 01/01/2009
Featured Products
Date: November, 2008
ALD, CVD in one tool
The AltaCVD targets plasma-enhanced MOCVD and ALD processes of a wide range of materials used in logic and memory devices, as well as in microsystems and 3D integration. It encompasses both chemical vapor deposition (CVD) and atomic layer deposition (ALD) through a unique vaporizing technology, chamber design, and gas/liquid panel to deposit new, viscous, and nonvolatile precursors. A proprietary reactor design and precursor introduction path with a pulsed liquid injection and vaporization enables nanoscale control of thickness, uniformity, composition, and stoichiometry. Altatech, Grenoble-Montbonnot, France; ph +33/456.526.800, www.altatech-sc.com.
Defect inspection for HDDs
The Candela 7100 series for advanced defect inspection and classification of hard disk drive substrates and media (both metal and glass) incorporates a new dual-wavelength laser configuration, which is optimized for higher sensitivity, flexibility in application recipe settings for layer-based power modes, and improved laser output and stability. Multiple independent scatter detectors enable detection and classification of sub-micron defects (pits, bumps, particles, buried defects). Improved phase, specular, and magnetic channels offer improved sensitivity and stability for capturing stains and imaging advanced perpendicular magnetic recording (PMR) surfaces. KLA-Tencor Corp., Milpitas, CA; ph 408/875.3000, www.kla-tencor.com.
6-in-1 mask alignment/bonding
The third generation of the MA/BA8 mask/bond aligner offers submicron alignment (down to 0.25µm) and exposure optics dedicated for thick resist exposure, upgradeable to emerging technologies such as UV (NIL, SCIL) and microlens imprinting (SMILE), UV-bonding, and enhanced bond alignment. It also offers shadow mask alignment for evaporation applications, and a near-field holography module for producing diffractive gratings down to 100nm. Processes developed on the MA/BA8 Gen3 can be quickly transferred onto an automated Suss mask aligner for high-volume production, which is based on the same technology. Suss MicroTec, Garching, Germany; ph +49/893.2007.395, www.suss.com.


