CMP process control system

The FullVision system enables real-time control of dielectric CMP processes to the 45nm device node and beyond. The system couples this company’s patented window-in-pad technology with multiple-wavelength spectroscopy to deliver advanced in situ endpoint capability for a variety of dielectric materials, including oxide, STI, and poly CMP applications. The system demonstrates high repeatability across all applications with less than 150Å, 3σ endpoint accuracy on patterned wafers. Using broadband spectral analysis, FullVision technology monitors individual polishing zones across the wafer to reportedly provide twice the accuracy and repeatability of competitive systems on a wide variety of process steps without compromising throughput. Applied Materials, Santa Clara, CA USA; www.appliedmaterials.com.

Mask inspection systems

The TeraFab family of reticle inspection systems offers wafer fabs flexible options to qualify incoming masks and inspect production masks for contaminants that reduce yield and increase production risk. The TeraFab mask inspection systems feature key advances in detection algorithm technology that can reduce yield loss while also enabling users to choose the right combination of inspection capabilities for their needs. The systems are offered in three base configurations: the TeraFab SLQ-2X, primarily for logic customers, with the new STARlight2+ algorithm and smallest pixels for highest sensitivity; the TeraFab Q-3X, a specialized system for multiple-die requalification and incoming quality control applications; and the TeraFab SLQ-1X with lowest CoO and highest ease of use. KLA-Tencor, San Jose, CA USA; www.kla-tencor.com.

Noncontact wafer thickness measurement system

The OptiGauge precision thickness measurement uses super luminescent emitting diode (SLED) technology to accurately measure the thickness of silicon wafers using infrared light. It operates on the principle of low coherence interferometry. Since silicon is highly transmissive at the OptiGauge operating wavelength of 1310nm, it is relatively easy to accurately measure thickness of wafers from 12μm to 2.5mm thick using this noncontact technology. The system’s high measurement scanning speed provides real-time measurements that can be taken in situ during the grinding, lapping, and polishing process without having to completely dry the wafer for measurement. It can measure multiple layers of material simultaneously, making nondestructive, noncontact wafer backside measurements through epoxy or tape support materials possible. Lumetrics Inc., Rochester, NY USA; www.lumetrics.com.

Parts cleanliness testing station

The Surfex 100M tabletop monitor is a compact, integrated particle extraction system for monitoring and qualifying part cleanliness. By combining ultrasonic extraction, particle measurement, and high purity fluidics, the monitor reportedly increases testing throughput up to ten-fold over traditional methods, saving time and money. The system is specially designed to count particles on small complex devices, irregular shaped parts, consumables, and components typical of the pharmaceutical, medical device, disk drive, and automotive industries. Particle counting is performed and archived with SamplerSight software, which meets all current USP, EP, and JP requirements. Particle Measuring Systems, Boulder, CO USA; www.pmeasuring.com.