Recent Features
- integrated ODP metrology with floating n&k’s 06/01/2009
- Engineered to the task: why camera-phone cameras are different 06/01/2009
- Thin films for 3D: ALD for non-planar topographies 06/01/2009
- Combined reflectometry-ellipsometry technique to measure graphite down to monolayer thickness 06/01/2009
- Memory sector ready to rebound? Not quite 06/01/2009
Recent Products
- Centura Enabler E5 01/01/2009
- Enviro Xceed400 01/01/2009
- NT series of aligners and measurement systems 01/01/2009
- V6000 01/01/2009
- 655D CVD 01/01/2009
Zygo buys Solvision for backend inspection play
Date: February, 2008
Feb. 29, 2008 - Zygo says it has acquired the assets of Solvision, a Canadian provider of visual inspection equipment, for an undisclosed amount.
The deal, which includes Solvision's Singapore subsidiary, gives Zygo an entry into in-line inspection of flip-chip substrates and packaged ICs, and Solvision's Fast Moire Interferometer offers rapid 3D inspection, the company noted in a statement. Jim Northup, president of ZYGO's metrology solutions division, noted that it is a continuation of a strategy to seek growth in inline process control, and move beyond the wafer.
"Zygo's strength in high precision metrology, coupled with the high-speed vision capabilities we have just acquired, positions us very well to serve the full semiconductor market," he stated.
Development of the 3D tool and flip-chip substrate equipment will occur in Montreal, while the IC packaging inspection products will continue to be developed and manufactured in Singapore.


