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Solid State Technology - semiconductors, chips, integrated circuits

Technology

Mining high-precision CD-STEM data for TFH manufacturing
Nov 20 -- CD-STEM technology has been successfully deployed in thin-film magnetic head wafer production environment where it has generated immediate, measurable benefits in effective yield management....
 
KLA-Tencor gets the noise out with latest plasma monitor
Oct 22 -- KLA-Tencor's Rangesh Raghavan discussed the architecture and capabilities of the company's new PlasmaVolt X2 system, which measures plasma chamber conditions in semiconductor wafer processing systems, including above-the-wafer effects....
 
Inside Rudolph's new inspection modules
Oct 03 -- Rudolph Technologies product manager Tuan Le tells SST about the improvements in its systems for detecting edge defects, necessitated by the switch to immersion lithography at 45nm....
 
KLA-Tencor takes a tailored approach to defect detection
Sep 16 -- KLA-Tencor exec Rahul Bammi tells SST about the company's latest version of its Surfscan SP2XP defect inspection tool, and two of its key features: custom polarizers to enhance sensitivity, and a well-known image-capture technology borrowed from microscope manufacturers....
 
Analysts: KLAC+Vistec is a mask metrology play
Jul 31 -- Gartner and VLSI Research analysts tell SST what's the driving interest behind KLA-Tencor's proposed acquisition of Vistec Semiconductor Systems' inspection business, and where areas of overlap might be leveraged to take on other sector competitors....
 
FEI tips extreme SEM, transition help to STEM
Jul 15 -- FEI Co. is debuting a new line of SEM tools designed to give researchers a sharper picture of sub-nanometer surface detail than with a SEM. It also is rebundling its technologies to smooth a SEM-to-STEM transition ....
 
KLA Tencor announces Archer 200 overlay metrology system
Jun 05 -- by M. David Levenson, Editor-in-Chief, Microlithography World
June 5, 2008 - Overlay specifications have narrowed dramatically as the semiconductor industry advances toward the 32nm node, requiring control of high-order grid and field distortions, as noted by the ITRS. Seeking to meet these new requirements is KLA-Tencor's new Archer 200, the latest version of the company's imaging overlay measurement tool....
 
 

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