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Solid State Technology - semiconductors, chips, integrated circuits
NIST creates toughness test for low-k films
Jan 05 -- Researchers at the National Institute of Standards and Technology (NIST) have updated a well-known technique for measuring material properties to gauge the mechanical strength of low-k films, to help devicemakers better identify interconnect dielectric film candidates....
JSR bumping resist prices
Nov 13 -- JSR Corp. says it will raise prices for its g- and i-line "PFR" series photoresists by 6%-10% to offset "substantial" increases in its raw materials and utility costs....
Wacker spending €760M to add 10k MT capacity
Oct 20 -- Wacker Chemie AG has laid out plans to build a new 10,000 metric ton polysilicon facility (dubbed "Poly 9") in Nünchritz, Saxony, Germany, with first material to be ready by 1Q11 and full production achieved by the end of that year....
Report: Formosa Sumco debuting "jumbo" Si ingots
Oct 02 -- Formosa Sumco Technology is rolling out a king-sized version of silicon wafer ingots to make 300mm wafers capable of producing 60% more chips, an upgrade that fits into the firm's plans to boost overall wafer output by 23%....
Scientists grow 'nanonets' to snare added energy transfer
Sep 03 -- Using two abundant and relatively inexpensive elements, Boston College chemists have produced nanonets, a flexible webbing of nanoscale wires that multiplies surface area critical to improving the performance of the wires in electronics and energy applications....
What materials firms can learn from Yogi Berra
Jul 16 -- Where to turn for inspiration in a tough year 2008 for semiconductor suppliers? Try Yankee baseball great Yogi Berra and famously underappreciated comic Rodney Dangerfield, according to analyst John Housley of Techcet, in a Wednesday talk about materials forecasts at SEMICON West....
ATMI's exclusive partnership with Intermolecular drives expansion
Jul 15 -- ATMI's exclusive partnership with Intermolecular has now extended further with ATMI's launch of four "High-Productivity Development Centers" in the US and Asia to provide more rapid and efficient methods of integrating new development and manufacturing processes....
Dow Chemical, Rohm & Haas announce "game-changing" M&A
Jul 11 -- In a blockbuster consolidation move, Dow Chemical is acquiring Rohm & Haas in a cash deal worth about $15.3M, citing synergies and complementary technologies in various specialty chemicals and materials areas....
Tiger Optics' Tiger-i analyzer eyes molecular contaminants
Jul 10 -- Tiger Optics says its latest analyzer, Tiger-i, targets ambient molecular contaminants (AMCs), in particular HF and HCl, which can contribute to the formation of ammonium chloride and ammonium fluoride microcrystals, the origin of "haze" on wafer surfaces and reticles....
Toshiba, IBM tip CMOS FET with improved direct silicon bonding
Jun 22 -- Toshiba and IBM say they have developed a higher-performance CMOS FET by increasing device-channel hole mobility through a modification of direct silicon bonding (DSB), a hybrid of (100) and (110) substrates, rather than new materials such as high-k and metal gates and new structures....
Freescale carves out MRAM biz
Jun 09 -- June 9, 2008 - Freescale Semiconductor is spinning off its MRAM unit as a VC-backed independent company to expand its technology portfolio and accelerate its adoption in new applications...
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