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Solid State Technology - semiconductors, chips, integrated circuits

Features

EDA interface value proposition
Oct 01 --  Cycle-time improvements and time-waste reduction are being accomplished by improving equipment setup times and operations....
 
Using DFM hot-spot analysis for predicting resist patterns
Dec 01 -- As process tolerances decrease, significant yield losses are observed specifically due to differences between the design layout and how the resist actually prints on the wafer....
 
A flexible ‘wrapper’ enables secure IP sharing
Aug 01 -- The growing need for collaboration in the semiconductor industry has created an additional challenge: protection of intellectual property (IP) while sharing capabilities in wafer fabs....
 
Middleware layers could lead to plug-and-play automation
Nov 01 -- The emergence of equipment data acquisition (EDA) standards, such as the new Interface A standard, opens up the possibility of plug-and-play manufacturing tools with greater levels of automation in semiconductor fabs....
 
Analyzing strained-silicon options for stress-engineering transistors
Jul 01 -- Future silicon technology will depend on locally strained silicon channels to squeeze higher currents from each process node....
 
Optimizing fab performance with MES-database active archiving
Apr 01 -- Increasingly, it is a challenge to manage the large volumes of data being captured and stored inside a fab's manufacturing execution software (MES) database....
 
The status and future of APC software
May 01 -- Statistical process control has played a large role in semiconductor manufacturing, but sophisticated physically based models recently have revealed an underlying structure rather than random processes with unknown causes of variation. Now, advanced process control is emerging as the next level of controlling wafer fab effectiveness and a manufacturer's competitiveness....
 
The "soft" art of improving fab production schedules
Jul 01 -- Changes in semiconductor manufacturing accompanying the move to 300mm wafers and the continual shrinkage of critical dimensions are placing new demands on essentially all fab systems. In particular, connections between the MES, the transport system, the equipment integration systems, and the scheduler must become more robust and rich....
 
TCAD physical verification for reticle enhancement techniques
Jul 01 -- The industry's accelerating use of reticle enhancement technologies—optical proximity correction and phase shift masking—has brought along with it a need for automatic verification of photomask images, which are no longer exact replicas of the circuit design layout....
 
The semiconductor industry's Semi standard GUI
Jul 01 -- The new Semi Standard E95-0200 specifies a unified user interface GUI for the semiconductor industry. A straightforward, intuitive screen layout displays information in an efficient and comfortable manner to enable operators to navigate critical function controls accurately and rapidly. Such an industry standard simplifies software development and equipment operation and reduces production errors in the fab....
 
Software, hardware, and engineering decisions for inkless assembly
Jun 01 -- Inkless assembly solves these problems because it uses electronic wafer maps instead of ink to classify good and bad die. In addition, inkless assembly enables software-driven material inventory tracking and gives process control engineers a usable form of history that can help them determine yield loss....
 
 

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