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Solid State Technology - semiconductors, chips, integrated circuits

Features

2009 Economic forecast Look for rebound by 2010
Jan 01 -- During the first half of 2008, the chip market held up well, better in fact than many predicted, but come the second half, the repercussions of the US sub-prime disaster had spread to the bigger global financial system, tipping the US and Europe into recession....
 
Status and trends in 300mm manufacturing
Jan 01 -- In the second quarter of 2008, 300mm wafers passed 200mm wafers as the highest production volume wafer size on a sq. in. basis [1]. Announcements of 200mm fab closings by memory producers in favor of lower cost 300mm production seem to come almost daily....
 
The year ahead: a time for innovation
Jan 01 -- Technology-driven growth is still possible in the current downturn, according to SST’s poll of executives from across the semiconductor manufacturing supply chain....
 
High-k etch performance for next-generation logic gate stacks
Dec 01 -- Dry etching is essential for high-performance metal gate/high-k devices at 45nm and beyond....
 
Using combinatorial science to qualify new processes and materials
Dec 01 -- The introduction of new materials into semiconductor manufacturing process flows is generating unprecedented improvements in integrated circuit (IC) performance....
 
III-V MOSFETs for future CMOS transistor applications
Dec 01 -- III-V semiconductors are commonplace in laser and lighting applications and provide enabling components, such as power amplifiers, for mobile products including handsets and WLAN transceivers....
 
Optical in situ monitoring in LED device production
Nov 01 -- The most significant issue in LED MOCVD growth today is precise control of the wafer temperature throughout the whole growth process....
 
Parylenes for flexible electronics and display applications
Nov 01 -- A chemical vapor deposition (CVD) polymer technology has been developed to use low cost monomers and provide highly crystalline and thermally stable polymer films for the sub-65μm ICs and OLED display applications....
 
Raising the bar on wafer edge yield—an etch perspective
Nov 01 -- A variety of plasma techniques have been introduced to manage the unique dielectric and conductor etch challenges encountered at the wafer’s edge, as well as address bevel-clean challenges that impact yield....
 
A vision for a next-generation 300mm factory
Oct 01 -- To help meet next-generation factory (NGF) challenges, ISMI has been tasked by its member companies to explore ways in which improvement in cycle time and cost reductions can achieve targets of 50% and 30%, respectively, by 2012....
 
EDA interface value proposition
Oct 01 --  Cycle-time improvements and time-waste reduction are being accomplished by improving equipment setup times and operations....
 
ISMI targets non-product wafer reduction
Oct 01 -- The International SEMATECH Manufacturing Initiative (ISMI) has identified the use of non-product wafers (NPWs) as one of the significant costs to the fab....
 
Realizing the 450mm transition
Oct 01 -- The International SEMATECH Manufacturing Initiative (ISMI) is actively involved in building the foundational infrastructure and coordination of activities to enable a 2012 pilot line target date at the direction of its members....
 
Reference metrology and standards: staying ahead of the ITRS
Oct 01 -- The International SEMATECH Manufacturing Initiative’s (ISMI’s) Metrology Program, as a result of its charter to evaluate leading-edge metrology, spends a great deal of time building and evaluating testing structures and techniques....
 
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