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Solid State Technology - semiconductors, chips, integrated circuits

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A collaborative course for HDD manufacturing
Jan 01 -- The hard disk drive (HDD) industry has been evaluating lithographically patterned media as a vehicle to maintain the ∼40% per year growth in areal density, to well beyond 1Tb/in2....
 
ASML “double-dips” with updated litho tool
Jan 01 -- Double patterning immersion lithography will be the dominant manufacturing paradigm at 32nm, and ASML announced at SEMICON Japan (Dec. 3) a new exposure tool designed for the most litho-intensive version of it: LELE, or “double-dip.”...
 
Featured Products
Jan 01 -- The V6000 product line enables testing of both flash and DRAM memory on the same automated test equipment platform by changing to a new test program and probe card....
 
Latest 32nm CMOS, memory beyond flash, plus novel devices detailed at 2008 IEDM
Jan 01 -- New memory concepts and the latest 32nm CMOS with metal gates and high-k dielectrics were highlights of the 2008 International Electron Devices Meeting (IEDM) in San Francisco, Dec. 15-17....
 
Product News
Jan 01 -- Dyneon’s Adona emulsifier eliminates the use of ammonium perfluorooctanoate (APFO)â??a salt derived from perfluorooctanoic acid (PFOA)â??from production of fluoropolymers, which the EPA has mandated to be eliminated in 2015....
 
Recessions: a potent time for R&D
Jan 01 -- Writing anything about the economy these days is like trying to hit a moving target (a quickly dropping target I might add) so let me first say “thank you” to the many forecasters, analysts, and company executives who had the gumption to provide their perspectives for this forecast issue....
 
Applied accelerating TSV implementation, launches Silvia etch tool
Jan 01 -- Sizing up a TSV market beyond the early adoptersâ??e.g., image sensors, server DRAM, and communication/mobile Internet devicesâ??Applied Materials is collaborating with material and equipment suppliers (and others) to ensure the full readiness of TSV implementation with a target cost <$150/wafer....
 
Analysts: “Long, dark season” ahead
Dec 01 -- Many OEMs held off on the usual holiday-season production ramp amid expectations of weak consumer demand due to the global economic crisis, and this has created a ripple effect all along the electronic systems supply chain from ODMs and EMS companies to chip packaging and foundries, and ultimately causing a shortfall in 4Q08 chip orders, notes Gartner in a research report....
 
Featured Products
Dec 01 -- ...
 
Haze and sun for mask symposium
Dec 01 -- Ever since lithographers began exposing with 193nm DUV light, photomasks have accumulated photochemical haze that eventually congeals into crystalline defects....
 
Inside Oxford/TDI’s HVPE technique for InGaN growth
Dec 01 -- TDI, an Oxford Instruments company, recently announced that it has developed a hydride vapor phase epitaxy (HVPE) technology that is based on a GaCl3-InCl3-NH3 system....
 
KLA-Tencor gets the noise out with latest plasma monitor
Dec 01 -- KLA-Tencor recently introduced the PlasmaVolt X2 for measurement of plasma chamber conditions in semiconductor wafer processing systems....
 
 
Photovoltaics World Launch
Dec 01 -- We have been covering the photovoltaics manufacturing industry for quite some time in Solid State Technology and a variety of other PennWell brands, most notably Renewable Energy World, Laser Focus World, Vision Systems Design and Power Engineering....
 
 

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