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Solid State Technology - semiconductors, chips, integrated circuits
Intevac buying Oerlikon's magnetic media biz
Jun 27 -- June 27, 2008 - Intevac has agreed to purchase OC Oerlikon Balzers' magnetic media equipment business, a deal that bolsters Intevac's systems and IP and helps Oerlikon streamline operations and shed noncore assets....
Orbotech buying Photon Dynamics for $290M
Jun 26 -- June 26, 2008 - Israeli firm Orbotech, a supplier of automated optical inspection equipment for printed circuit boards and flat-panel displays, has agreed to purchase Photon Dynamics for $290M in cash in an effort to spur growth and diversify their FPD businesses....
Mattson laying off 5% of workers, spares new product R&D
Jun 26 -- June 26, 2008 - Citing pressures from a continued memory sector slump, Mattson Technology says it is laying off 5% of its workforce (~25 employees) by the end of the next fiscal quarter, in an effort to reduce costs in certain areas while sparing new product investments and other initiatives....
Asyst fields another shareholder buyout proposal
Jun 26 -- June 26, 2008 - Just weeks after fending off one investor's renewed attempt at a takeover, Asyst Technologies finds itself pursued by yet another that seeks to replace board directors and then sell the company at auction....
Samsung, Hynix joining to spearhead Korean chip industry
Jun 25 -- June 25, 2008 - Samsung and Hynix have publicly confirmed that they are working to jointly develop memory technology and are forming a "united front" to maintain Korea's status in developing next-generation semiconductors, and also support their domestic supplier base....
Analysts: TSMC's 2Q sales, shipments up, but margins "limited"
Jun 25 -- June 25, 2008 - TSMC's 2Q08 revenue should be at the high end of guidance (roughly US$2.86-$2.92B, 0-2% vs. 1Q08), and 3Q is looking brighter, but for now the upswing isn't enough to increase profitability, according to an analysts from FBR Research....
Gartner: Semi IP firms should focus on design costs, M&A exposure
Jun 23 -- June 23, 2008 - The global market for semiconductor IP rose 8% in 2007 driven by chip integration and cost, settling into a more muted pattern after three years of double-digit growth, with continued consolidation/M&A in the sector as vendors wrestle over marketshares, according to data from Gartner....
Credence, LTX propose "merger of equals"
Jun 23 -- June 23, 2008 - Automated test equipment providers Credence and LTX say they have agreed to merge their companies in a deal that they project will save them ~$25M. While bullish on their combined prospects, investors seem to think otherwise....
Report: Ferrotec seeking solar cell inroads to break "chip rut"
Jun 20 -- June 20, 2008 - Chip equipment firm Ferrotec is one of many companies seeking to diversify into new growth opportunities, and its move into solar cells seems to have met with applause from investors and market players, notes the Nikkei daily....
SEMI: Monthly tool demand slips to three-year lows
Jun 20 -- June 20, 2008 - Offering more evidence for chipmakers' belt-tightening this year, semiconductor equipment demand has slumped to three-year lows, to levels not seen since mid-2005, according to the latest monthly data from SEMI....
Spansion broadening outsourcing plans, narrowing focus on MirrorBit flash memory
Jun 19 -- June 19, 2008 - Spansion says it is extending its plan to hand off manufacturing and technology work to external partners in order to focus its capital investments on accelerating development of leading-edge MirrorBit flash memory technology, other "value-added, high-margin solutions," and its newest SP1 300mm flash memory fab in Aizu-Wakamatsu, Japan....
Toppan, IBM tie off 32nm photomask work, eye 22nm
Jun 19 -- June 19, 2008 - Toppan Printing and IBM have forged a new development agreement covering the final phase of 32nm photomask process development, and all phases of 22nm photomask process development. Work will start this month at IBM's photomask facility in Essex Junction, VT....
Samsung, Siltronic ramp Singapore 300mm wafer plant
Jun 19 -- June 19, 2008 - Samsung Electronics and Siltronic AG have begun operations of their 300mm wafer-making JV in Singapore, Siltronic Samsung Wafer Pte. Ltd., 18 months after construction began and two years after its formation. Monthly capacity is targeted at 300,000 wafers/month by 2010, with an overall investment of $1B....
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