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Analysts: “Long, dark season” ahead
Dec 01 -- Many OEMs held off on the usual holiday-season production ramp amid expectations of weak consumer demand due to the global economic crisis, and this has created a ripple effect all along the electronic systems supply chain from ODMs and EMS companies to chip packaging and foundries, and ultimately causing a shortfall in 4Q08 chip orders, notes Gartner in a research report....
Haze and sun for mask symposium
Dec 01 -- Ever since lithographers began exposing with 193nm DUV light, photomasks have accumulated photochemical haze that eventually congeals into crystalline defects....
Photovoltaics World Launch
Dec 01 -- We have been covering the photovoltaics manufacturing industry for quite some time in Solid State Technology and a variety of other PennWell brands, most notably Renewable Energy World, Laser Focus World, Vision Systems Design and Power Engineering....
Betting on a 2009 recovery? Not so fast
Nov 01 -- Gartner now expects capex to slide even further this year (-25% to $47.1B) and will drop another 13% in 2009 to $41.1B, thanks to a full-on collapse in memory investments and economic pressures on consumer spending habits. Look for a pickup in 2010 (16.7% to $47.9B) and a bigger surge in 2011 (23.1% to $59.0B), and then another downturn in 2012 (-10.5% to $52.8B)....
Diskcon: HDD litho crossover happening now
Nov 01 -- A full-day symposium at this year’s Diskcon USA (Sept. 14-18) explored the lithography implications of sub-ITRS roadmap feature sizes on disk drives, with the challenge that HDD lithography must cost 10Ã? less than NAND flash lithography, the lowest-cost semiconductor process....
Kudos to Tech Award Laureates
Nov 01 -- This month, a group of individuals will receive some well deserved recognition for their work in developing technical solutions that benefit humanity and address the most critical issues facing our planet and its people....
To 32nm and beyond: a design-manufacturing symbiosis
Nov 01 -- At the 32nm node, technology enablers such as double-patterning, strain enhancement, advanced OPC, etc., require design for manufacturing (DFM) to support a design through manufacturing (D2M) methodology that is correct-by-construction....
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