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Past Issues

2007

Solid State Technology

Volume	Issue	Date
50	12	Dec 01, 2007
50	11	Nov 01, 2007
50	10	Oct 01, 2007
50	9	Sep 01, 2007
50	8	Aug 01, 2007
50	7	Jul 01, 2007
50	6	Jun 01, 2007
50	5	May 01, 2007
50	4	Apr 01, 2007
50	3	Mar 01, 2007
50	2	Feb 01, 2007
50	1	Jan 01, 2007

Microlithography World

Volume	Issue	Date
16	4	Nov 01, 2007
16	3	Aug 01, 2007
16	2	May 01, 2007
16	1	Feb 01, 2007

Previous Years

2009 2008 2006 2005 2004 2003 2002 2001 2000 1999 1998 1997 1996

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Other Publications

CleanRooms Laser Focus World Surface Mount Technology Connector Specifier Advanced Packaging

Technology Articles

Applications Articles

Up Front

2007 IEDM: Darts hit elements all over the period table
Over 1600 technologists are gathered in Washington, DC, to explore a wide range of innovative ideas at the 2007 International Electron Devices Meeting (IEDM). While current mainstream CMOS approaches, ...

Intel at IEDM: 45nm HK+MG, variation mitigation, Moore's Law beyond 2015
Intel execs revealed highlights from select papers the company will be presenting at IEDM, including some details about its 45nm HK+MG transistors that incorporate a redistribution layer as part of a ...

Successful MEDEA+ collaboration to continue under CATRENE
This year's MEDEA+ annual forum in Budapest, Hungary (Nov. 26-28) reviewed final projects for the eight-year pan-European collaborate program for microelectronics R&D, set to expire in 2008 after over ...

Interview: Chinese tool firm AMEC tips equipment, strategy
Gerald Yin, CEO and co-founder of equipment startup Advanced Micro-Fabrication Equipment Inc. (AMEC), discusses his company's foray into thin-film deposition and etch tools for leading-edge IC manufac ...

HDDs vs. SSDs redux, at IDEMA breakfast panel
NAND flash memory manufacturers have made no secret about their rosy outlook for solid-state drives (SSDs) in consumer applications and notebook computers, as well as projected lower cost/GB and incre ...

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Tech Talk

Axcelis mixes it up at high energy with latest implanter
WaferNEWS gets the scoop about Axcelis' new Optima XE high-energy single-wafer ion implanter, and why its broad energy range and even broader range of device applications addresses a particular ...

Surface similarities hide big differences in display and photovoltaic needs
At first glance, flat-panel displays and solar cells seem to have a lot in common: both depend on diodes and transistors, usually implemented in silicon, and both are highly competitive markets where ...

KLA-Tencor's WaferSight2 sees wafer nano-topo
With lithography depth-of-focus specs pushing on other areas of technology, one area that has taken up the slack is the starting silicon wafer's planarity. Another area of concern is minimizing a nano ...

IMEC at IEDM: PVD for workfunction metals going forward?
Researchers at IMEC gave WaferNEWS a preview of the group's papers to be presented at next week's IEDM 2007 conference in Washington, DC. Topics include PVD used for workfunction electrode meta ...

KLA-Tencor ellipsometer now goes to 150nm; ONO stacks resolved
Spectroscopic ellipsometers (SE) have been used for decades to provide thickness and composition information for thin dielectric films. Most broadband SEs have been limited by optics hardware to resol ...

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Technology News

IBM licensing Infineon's 130nm embedded flash
December 21, 2007 - IBM has agreed to license Infineon Technologies' 130nm embedded flash technologies, expanding IBM's custom foundry services capabilities and giving Infineon an extra manufacturing ...

ASML, Zeiss, Canon licensing litho tool IP
December 21, 2007 - ASML and Carl Zeiss SMT say they have agreed to cross-license patents with Canon in their respective fields of semiconductor lithography and optical components, meaning they can ma ...

Tower eyes $500M market for X-ray detectors
December 20, 2007 - Israeli foundry Tower Semiconductor is finding new applications for its process technologies through a partnership with CMT Medical Technologies to develop and market flat-panel X- ...

Japan firm's film sputtering method wastes no Cu
December 19, 2007 - ShinMaywa Industries has developed a method for sputtering copper thin films onto semiconductor substrates that wastes virtually none of the starting material, according to the ...

Toshiba aligns with IBM, others for 32nm CMOS
December 18, 2007 - Toshiba has extended its two-year collaboration with IBM on 32nm-and below node technologies to now include 32nm bulk CMOS process technology, joining five other participants in th ...

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Feature Articles

December 2007 Exclusive Feature #2: ISSM's spirited debate
By Debra Vogler, Senior Technical Editor
The International Symposium on Semiconductor Manufacturing (ISSM), running from Oct. 15-17 in Santa Clara, CA, was full of spirited debate, especially ab ...

December 2007 Exclusive Feature #1: "In-the-trenches" roundup of ISMI
By Debra Vogler, Senior Technical Editor
The tradition of the ISMI Manufacturing Symposium as an "in the trenches" conference, by and for the people doing the actual day-to-day work in the fabs, c ...

September 2007 Exclusive Feature:
SPECIAL REPORT:
The rise of solar power
By Phil LoPiccolo, Editor-in-Chief
The promise of photovoltaics (PV)—to solve the world's energy problems as well as fuel semiconductor industry growth—drew overflow crowds to presenta ...

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Chip Forensics

SST May 2007: FujiFilm Microdevices achieves a means of tweaking CCD sensitivity
EXECUTIVE OVERVIEW This monthâ��s edition of Chip Forensics by analyst Dick James delves into the manufacturing of a charged-coupled device (CCD) sensor for a FujiFilm digital camera with ISO 3200 sen ...

SST March 2007: Freescale's process and fab strategy puts a new spin on MRAM
Freescale was recently honored with a product award for its magnetoresistive random access memory (MRAM) product, the Freescale MR2A16ATS35C 4-Mbit MRAM.

SST January 2007: Infineon uses vertical structure to optimize on-resistance in power MOS devices
Consumer products have become a leading technological and market driver of the semiconductor industry, fostering an ever-increasing demand for power density in devices targeted for that segment.

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Chart Watch

Private equity funds see opportunity in Japanese chipmakers
Japanese chipmakers may now look compelling enough to private equity funds to overcome longstanding issues with acquisitions in Japan. iSuppli tells SST partner Nikkei Microdevices what' ...

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Business News

Reports: Taiwan's AU Optronics eyeing LEDs
December 21, 2007 - Taiwan's top display panel supplier AU Optronics is reportedly venturing into production of epitaxy for LEDs with a new subsidiary, gaining a foothold in a market seen as key for d ...

NXP buying US fabless GPS chip firm
December 21, 2007 - NXP Semiconductors (nee Philips' semiconductor business) is acquiring Newport Beach, CA-based fabless company GloNav, a developer of single-chip technology for global positioning s ...

Sino-American buying TI epi spinoff, eyes EU PV inroads
December 21, 2007 - Sino-American Silicon Products, a Taiwanese maker of medium-and small-diameter silicon wafers (and second only to Green Energy Technology in terms of domestic wafer capacity), has ...

RF Micro strengthens GaAs pHEMT output with Filtronic unit
December 21, 2007 - RF Micro Devices has agreed to acquire Filtronic PLC's compound semiconductors subsidiary for about £12.5M (US ~25.1M) in cash, including the unit's 150mm GaAs wafer fab in t ...

Gartner: Brace for 10% slide in 2008 capex
December 20, 2007 - Semiconductor equipment spending will slip 9.9% in 2008 in large part due to measures taken to absorb memory oversupplies, though the second half of the year should pick up strengt ...

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