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2006

Solid State Technology
Volume Issue Date
49 12 Dec 01, 2006
49 11 Nov 01, 2006
49 10 Oct 01, 2006
49 9 Sep 01, 2006
49 8 Aug 01, 2006
49 7 Jul 01, 2006
49 6 Jun 01, 2006
49 5 May 01, 2006
49 4 Apr 01, 2006
49 3 Mar 01, 2006
49 2 Feb 01, 2006
49 1 Jan 01, 2006
Microlithography World
Volume Issue Date
15 4 Nov 01, 2006
15 3 Aug 01, 2006
15 2 May 01, 2006
15 1 Feb 01, 2006
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Up Front

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Tech Talk

    • New ZRAM 10x better, in tests at 65 and 45nm nodes
      Innovative Silicon Inc. (ISI), a developer of SOI memory cell IP, has released a Gen2 version of its zero-capacitor floating-body "ZRAM" technology, based on a standard SOI logic process with a simila ...
    • NXP, Sony forming JV for contactless ICs
      November 20, 2006 - NXP Semiconductors (nee Philips Semiconductors) and Sony Corp. have agreed to set up a joint venture to develop secure chips for contactless smart card applications. Work will focu ...
    • UMC touts working 45nm SRAMs
      November 20, 2006 - Taiwanese foundry United Microelectronics Corp. (UMC) says it has produced functional 45nm SRAM chips at its Fab 12A, using immersion lithography for 12 critical layers, as well as ...
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Technology News

    • Samsung tips 1Gb mobile DRAM
      December 27, 2006 - Samsung Electronics Co. Ltd. says it has developed a monolithic 1Gb mobile DRAM memory using 80nm process technology, and expects to ramp to mass production by 2Q07.
    • Cameca, IMEC to develop atom probe techniques
      December 27, 2006 - European consortium IMEC said it will collaborate with supplier CAMECA to develop future semiconductor applications for the company's tomographic atom probe technique, which is alr ...
    • Elpida ramps volume output of 70nm DRAM
      December 26, 2006 - Elpida Memory Inc. says it has begun mass production of 1Gbit and 512Mbit DDR2 SDRAMs using 70nm process technology at its main fab in Hiroshima, with product shipments expected to ...
    • New initiative aims to spur FPO display adoption
      December 19, 2006 - The US Display Consortium plans to launch an initiative focusing on the emerging market for flexible, printed and organic (FPO) electronics, including areas such as OLEDs, flexible ...
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Feature Articles

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Business News

    • ProMOS raising $600M to balance China move
      December 28, 2006 - ProMOS Technologies Inc. plans to issue $600 million worth of Euro-convertible bonds -- the island's largest such issuance this year -- to help fund a new 300mm fab in Taiwan as a ...
    • KLA board member Tompkins resigns
      December 28, 2006 - Jon Tompkins, board member and former CEO of KLA-Tencor Corp., has resigned from the company's board of directors, reportedly for "personal reasons," becoming the fourth top exec t ...
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