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Samsung unveils tiny cell-phone memory card
Dec. 14, 2004 -- Samsung Electronics has developed a fingernail-sized, low-power multimedia memory card (MMC) for mobile phones, about one-third the size of typical multimedia memory cards.

Researchers tout III-V silicon achievement
November 4, 2004 - Scientists from Royal Philips Electronics and the Kavli Institute of Nanoscience at Delft U., The Netherlands, claim they've achieved the first successful integration of III-V nanow ...

ASMI unveils new ultralow-k process
November 1, 2004 - ASM International NV, Bilthoven, The Netherlands, has developed a new process that enables porous low-k insulator materials in copper interconnects for 65nm devices.

IMEC explores self-adjusting circuits to solve future scaling problems
October 19, 2004 - Researchers at the Interuniversity MicroElectronics Center (IMEC) in Belgium have embarked on an ambitious system-level integration program that will explore circuit and system desi ...

IBM and Suss team up to get the lead out of semiconductor packages
September 15, 2004 - IBM Corp. and Suss MicroTec AG have struck an alliance to commercialize IBM's "C4NP" next-generation wafer solder-bump technology, described as the first flip-chip technology to s ...

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Dec. 2004 Exclusive Feature:
New vertical collaboration, government help called for at Nanotech Conference

By Bob Haavind, Editorial Director
New materials and process complexity require increased R&D, but available resources at process tool companies are being squeezed. As a result, new collab ...

Dec. 2004 Exclusive Feature:
China's first 300mm fab ramps, more to follow

By J. Robert Lineback, Senior Technical Editor
Mainland China's entry into volume production of 300mm wafers officially began in late September with the formal opening of a $1 billion fab ...

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