Past Issues 
2003
Solid State Technology
| Volume |
Issue |
Date |
| 46 |
12 |
Dec 01, 2003 |
| 46 |
11 |
Nov 01, 2003 |
| 46 |
10 |
Oct 01, 2003 |
| 46 |
9 |
Sep 01, 2003 |
| 46 |
8 |
Aug 01, 2003 |
| 46 |
7 |
Jul 01, 2003 |
| 46 |
6 |
Jun 01, 2003 |
| 46 |
5 |
May 01, 2003 |
| 46 |
4 |
Apr 01, 2003 |
| 46 |
3 |
Mar 01, 2003 |
| 46 |
2 |
Feb 01, 2003 |
| 46 |
1 |
Jan 01, 2003 |
Microlithography World
| Volume |
Issue |
Date |
| 12 |
4 |
Nov 01, 2003 |
| 12 |
3 |
Aug 01, 2003 |
| 12 |
2 |
May 01, 2003 |
| 12 |
1 |
Feb 01, 2003 |
View Complete Archives Section
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Top Stories
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Mid-4Q updates: Happy holidays for chipmakers!
December 5, 2003 - Halfway through the current fiscal quarter, several big chipmakers are spreading holiday cheer with revised financial outlooks.
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Japanese equipment orders continue to impress, while sales regress
December 1, 2003 - Global orders in October of Japanese semiconductor equipment soared above 100 million yen for the third consecutive month, and are at their highest levels in nearly three years, acc ...
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SIA: Chip sales continue double-digit growth
December 1, 2003 - Worldwide semiconductor sales continued to rebound in October, posting the eighth consecutive monthly increase and largest month-to-month gains since 1990, according to data from th ...
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At last: North American book-to-bill achieves parity, says SEMI
November 30, 2003 - Need more proof that the industry is pulling itself up? For the first time since August 2002, semiconductor equipment sales and orders reached the parity mark of 1.0 in October, ac ...
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Worldwide book-to-bill stays at parity in October, says VLSI
November 21, 2003 - Worldwide manufacturers of semiconductor equipment posted the first back-to-back months of parity this year with an October book-to-bill ratio of 1.03, maintaining September's leve ...
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Technology News
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IMEC, Sematech, TI join high-k club
December 10, 2003 - The past week has been busy for high-k materials, with three separate announcements from companies and organizations detailing the progress of their research.
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Japan institute licenses wafer technology
December 4, 2003 - Japan's Super Silicon Crystal Research Institute Corp. has licensed its wafer processing equipment to South Korea's Tera Semicon Corp. and Japan's Shinkugiken Co.
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AMAT introduces first automated in-line SEM/FIB system
November 28, 2003 - Applied Materials recently introduced the SEMVision G2 FIB defect analysis system, touted as the first in-line production tool to integrate several technologies into one system: ad ...
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Sematech qualifies low-k material
November 28, 2003 - International Sematech, Austin, TX, says it has qualified an ultra-low-k material for dual damascene copper processing at 0.13-micron features, using 193nm lithography on 300mm waf ...
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TEL, Clariant develop pattern-stabilization process
November 21, 2003 - TEL and Clariant Ltd. say they have created a process that helps prevent the collapse of resist patterns when drawn onto silicon wafers.
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Feature Articles
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Exclusive Feature: DEPOSITION
Using variance analysis to set up a BBr3
pre-deposition process
By Hamidreza Simchi, Semiconductor Component Industry, Tehran, Iran
The diffusion process has generally been explained using Fick's law without considering the effect of process gases. The ...
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Exclusive Feature: PHOTORESIST LIMITATIONS
Finding the limits of chemically amplified photoresists
By DarÃo Goldfarb, IBM T.J. Watson Research Center; Eric Lin, Christopher Soles, NIST; Brian Trinque, Univ. of Texas
Neutron reflectivity analysis reveals the dynamics of deprotection in a ...
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Exclusive Feature: ETCH
Selective wet etching of high-k materials
By Kurt Christenson, FSI International, Chaska, MN
The deposition of blanket films with a subsequent etch after gate patterning remains the leading candidate for integrating high-k ...
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