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Solid State Technology - semiconductors, chips, integrated circuits
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Analyst: Macro slump set to hit Asian chip markets
Oct 06 -
The worsening global macroeconomic environment and eroding consumer confidence won't spare even the strongest chip markets in Asia, though there are still some bright spots over the next few years, according to a report from Gartner.
Inside Rudolph's new inspection modules
Oct 03 -
Rudolph Technologies product manager Tuan Le tells SST about the improvements in its systems for detecting edge defects, necessitated by the switch to immersion lithography at 45nm.
Analyst: US credit crisis is more bad news for DRAM suppliers
Oct 03 -
Already banged up by a punishing downturn that has evaporated sales and profits (and capacity spending), DRAM suppliers must now deal with another problem: the US financial crisis will likely make it a lot tougher for them to handle debt and obtain new funds for capital spending, notes a new report from iSuppli.
Slowly but surely, EUV moves toward reality
Oct 02 -
EUV lithography is still a long way from manufacturing, not expected for mass production until at least 2012 and the 22nm node. But early work with alpha tools is giving a much better understanding of what the platform's capabilities will be, and where the needs are (optics, resists, sources). And at some point the answers will come only with taking risks and making the investment.
Realizing the 450mm transition
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The International SEMATECH Manufacturing Initiative (ISMI) is actively involved in building the foundational infrastructure and coordination of activities to enable a 2012 pilot line target date at the direction of its members.
Three years, two months to 2012
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We’re pleased to be bringing you this special issue, the result of a collaborative effort between ISMI and Solid State Technology, initiated last year.
DRAM, NAND woes seen spilling into 2009
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Despite a mild recovery in 2Q08, global DRAM makers are once again building inventories and pulling the rug out from prices, and the buildup will likely push out a full market recovery until the end of next year, according to a new warning by iSuppli.
Pinpointing the industry's disconnect between capex and utilization
Jul 29 -
by Pete Singer, editor-in-chief, Solid State Technology
George Scalise, president of SIA, talks with SST's Pete Singer about the semiconductor industry's disconnect between sluggish equipment demand and high capacity utilization, and offers possible answers to the conundrum.
WCJTG speakers summarize 32nm USJ progress
Jul 22 -
John O. Borland, organizer of the West Coast Junction Technology Group Meeting (WCJTG) held the final morning of SEMICON West, talks on camera to discuss the group's latest research, and other presenters provide summaries of their talks.
SEMI's policy wish-list for US prez candidates
Jul 18 -
Vicki Hadfield, president of SEMI North America, outlines SEMI's stance on the four "Ts" of US government policy key to its members (tax, trade, technology, and talent), with key elements including prioritization of alternative energy investments (notably tax credits for solar energy), a one-year depreciation for equipment, and an increase in the H1-B visa quota.
HP optimizes low-cost processing for inkjet printheads
Aug 22 -
One of the most common and most ignored types of chips is on almost every desk in this electronic world of ours -- the inkjet printhead. This edition of Chip Forensics examines a three-color printhead device out of Hewlett Packard's low-cost HP 60 Tricolor ink cartridge launched earlier this year.
Two different approaches to integrated MEMS
May 07 -
by Dick James, Senior Technology Advisor, Chipworks
May 12, 2008 - After the 45nm hype of the last few months, let's go to the other end of the CMOS scale and examine some interesting MEMS devices that are leading the penetration into new markets like consumer electronics -- and would not have been manufacturable without the deep etching processes that have evolved over the last few years.
SST September 2007: Looking inside Apple's iPhone: Rad-hard technology?
Sep 04 -
EXECUTIVE OVERVIEW In this edition of Chip Forensics, Dick James tears down Apple's 8GB iPhone, and the reverse engineering of a Peregrine RF switch similar to the one used by Apple within it, to look at the unusual silicon-on-sapphire (SoS) process used for its manufacture.
Quotes delayed at least 20 mins.
SPIE Photomask Technology 2008
October 6-10 2008
Monterey, CA
The annual SPIE/BACUS Symposium is a technical conference and exhibition for the photomask industry. Issues discussed include: mask infrastructure, mask integration, emerging mask technology, and mask business.
SEMICON Europa
October 7-9 2008
Stuttgart
International Wafer-Level Packaging Conference & Tabletop Exhibition
October 13-16 2008
San Jose, CA
The annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.
International Wafer-Level Packaging Conference & Tabletop Exhibition
October 13-16 2008
San Jose, CA
The annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.
Debra Vogler of Solid State Technology interviews Lars Liebmann, Distinguished Engineer, Design for Manufacturability at IBM, at the 2008 SPIE Advanced Lithography Conference.; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology; Debra Vogler of Solid State Technology interviews Benjamin Eynon, Associate Director of Lithography, and Samsung assignee to SEMATECH, at the 2008 SPIE Advanced Lithography Conference. ; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology; Debra Vogler of Solid State Technology interviews Mireille Maenhoudt, Litho Process Development Group Manager at IMEC, at the 2008 SPIE Advanced Lithography Conference.; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology; Debra Vogler of Solid State Technology interviews Franklin Kalk, CTO at Toppan Photomasks, at the 2008 SPIE Advanced Lithography Conference.; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology; Debra Vogler of Solid State Technology interviews John Sturtevant, RET Technology Support Manager at Mentor Graphics, at the 2008 SPIE Advanced Lithography Conference.; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology; Debra Vogler of Solid State Technology interviews Christopher Sparkes, Sr. Director of Technology at Nikon Precision, at the 2008 SPIE Advanced Lithography Conference.; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology;
Original broadcast on October 31, 2007
White Papers Online Learning
Sponsored White Paper Library
Cleaning Technology for Integrated Circuit Manufacturing
Helmuth Treichel; Dr. Robert Small; Dr. Jeffrey Butterbaugh; Karen Reinhardt; Dr. Maximillian Biberger
This course addresses fundamental cleaning issues for microelectronic manufacturing. Surface conditioning and critical cleaning, photoresist striping and cleaning, particle removal and brush cleaning plus advanced in new cleaning technologies are presented. Plasma and wet process methods and equipment are shown.
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